Yang Liang Poh

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Bukit Mertajam, MY

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
- Patent number 11,887,917
- Issue date Jan 30, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical die-to-die interconnects bridge
- Patent number 11,545,434
- Issue date Jan 3, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss high-speed interconnects
- Patent number 11,456,516
- Issue date Sep 27, 2022
- Intel Corporation
- Ling Li Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
- Patent number 11,049,801
- Issue date Jun 29, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL DIE-TO-DIE INTERCONNECTS BRIDGE
- Publication number 20210384130
- Publication date Dec 9, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED VERTICAL INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND...
- Publication number 20210217689
- Publication date Jul 15, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS HIGH-SPEED INTERCONNECTS
- Publication number 20210184326
- Publication date Jun 17, 2021
- Intel Corporation
- Ling Li Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED VERTICAL INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND...
- Publication number 20190304885
- Publication date Oct 3, 2019
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS