Yang Ti

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Conductive epoxy resin composition for copper bonding
- Patent number 12,344,739
- Issue date Jul 1, 2025
- Henkel AG & Co. KGaA
- Yang Ti
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silver sintering composition containing copper alloy for metal bonding
- Patent number 12,051,522
- Issue date Jul 30, 2024
- Henkel AG & Co. KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND U...
- Publication number 20240240067
- Publication date Jul 18, 2024
- Henkel AG & Co. KGaA
- Wei Yao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING
- Publication number 20230174773
- Publication date Jun 8, 2023
- Henkel AG & Co. KGaA
- Yang Ti
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
- Publication number 20220319733
- Publication date Oct 6, 2022
- Henkel AG & Co., KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
- Publication number 20210062047
- Publication date Mar 4, 2021
- Henkel AG & Co. KGaA
- Yang Ti
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...