Yang Yunfeng

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method and cutting apparatus
- Patent number 11,217,466
- Issue date Jan 4, 2022
- Disco Corporation
- Yunfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus
- Patent number 9,901,961
- Issue date Feb 27, 2018
- Disco Corporation
- Yang Yunfeng
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
CLEANING JIG AND CLEANING METHOD
- Publication number 20230271227
- Publication date Aug 31, 2023
- Disco Corporation
- Yunfeng YANG
- B08 - CLEANING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20230027338
- Publication date Jan 26, 2023
- Disco Corporation
- Yunfeng YANG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER PROCESSING METHOD AND CUTTING APPARATUS
- Publication number 20210050238
- Publication date Feb 18, 2021
- Disco Corporation
- Yunfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS
- Publication number 20150151337
- Publication date Jun 4, 2015
- Disco Corporation
- Yang Yunfeng
- B08 - CLEANING