Yang Zhao

Person

Andover, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS flow sensor
- Patent number 10,139,256
- Issue date Nov 27, 2018
- ACEINNA, INC.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for data fusion of a three-axis magnetometer a...
- Patent number 9,915,550
- Issue date Mar 13, 2018
- Memsic, Inc.
- Dong An
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
MEMS thermal flow sensor with compensation for fluid composition
- Patent number 9,874,467
- Issue date Jan 23, 2018
- ACEINNA, INC.
- Thomas O. Maginnis
- G01 - MEASURING TESTING
Information Patent Grant
Method for wafer-level chip scale package testing
- Patent number 9,676,619
- Issue date Jun 13, 2017
- MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic three-axis magnetic field sensor
- Patent number 9,658,298
- Issue date May 23, 2017
- Memsic, Inc.
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Grant
System and method for calibrating a three-axis accelerometer
- Patent number 8,718,963
- Issue date May 6, 2014
- Memsic, Inc.
- Dong An
- G01 - MEASURING TESTING
Information Patent Grant
Z-axis capacitive accelerometer
- Patent number 8,701,490
- Issue date Apr 22, 2014
- Memsic, Inc.
- Leyue Jiang
- G01 - MEASURING TESTING
Information Patent Grant
Location and path-map generation data acquisition and analysis systems
- Patent number 8,577,595
- Issue date Nov 5, 2013
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Magnetometer
- Patent number 8,525,514
- Issue date Sep 3, 2013
- Memsic, Inc.
- Yongyao Cai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Ion discharge gyroscope
- Patent number 8,146,423
- Issue date Apr 3, 2012
- Memsic, Inc.
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Grant
Magnetic sensor for use with hand-held devices
- Patent number 8,139,030
- Issue date Mar 20, 2012
- Memsic, Inc.
- Yang Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional multi-chips and tri-axial sensors and methods of...
- Patent number 7,536,909
- Issue date May 26, 2009
- Memsic, Inc.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Patent number 7,495,462
- Issue date Feb 24, 2009
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Devices, systems, and methods for controlling a shutter
- Patent number 7,496,286
- Issue date Feb 24, 2009
- Memsic, Inc.
- Yang Zhao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Single chip tri-axis accelerometer
- Patent number 7,424,826
- Issue date Sep 16, 2008
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Grant
Z-axis thermal accelerometer
- Patent number 7,392,703
- Issue date Jul 1, 2008
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Method and circuitry for thermal accelerometer signal conditioning
- Patent number 7,305,881
- Issue date Dec 11, 2007
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Chip-scale package for integrated circuits
- Patent number 7,295,029
- Issue date Nov 13, 2007
- Memsic, Inc.
- Yang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package for integrated circuits
- Patent number 7,262,622
- Issue date Aug 28, 2007
- Memsic, Inc.
- Yang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal convection accelerometer with closed-loop heater control
- Patent number 6,795,752
- Issue date Sep 21, 2004
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Method of etching a deep trench in a substrate and method of fabric...
- Patent number 6,712,983
- Issue date Mar 30, 2004
- Memsic, Inc.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rotatable micromachined device for sensing magnetic fields
- Patent number 6,621,266
- Issue date Sep 16, 2003
- Analog Devices, Inc.
- Richard S. Payne
- G01 - MEASURING TESTING
Information Patent Grant
Rotatable micromachined device for sensing magnetic fields
- Patent number 6,233,811
- Issue date May 22, 2001
- Analog Devices, Inc.
- Richard S. Payne
- G01 - MEASURING TESTING
Information Patent Grant
Conductive plane beneath suspended microstructure
- Patent number 5,858,809
- Issue date Jan 12, 1999
- Analog Devices
- Kevin Hin-Leung Chau
- G01 - MEASURING TESTING
Information Patent Grant
Rotatable micromachined device for sensing magnetic fields
- Patent number 5,818,227
- Issue date Oct 6, 1998
- Analog Devices, Inc.
- Richard S. Payne
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined device packaged to reduce stiction
- Patent number 5,694,740
- Issue date Dec 9, 1997
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure with textured surface and method for maki...
- Patent number 5,679,436
- Issue date Oct 21, 1997
- Analog Devices, Inc.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive plane beneath suspended microstructure
- Patent number 5,640,039
- Issue date Jun 17, 1997
- Analog Devices, Inc.
- Kevin Hin-Leung Chau
- G01 - MEASURING TESTING
Information Patent Grant
Method and circuitry for calibrating a micromachined sensor
- Patent number 5,621,157
- Issue date Apr 15, 1997
- Analog Devices, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Grant
High sensitivity integrated micromechanical electrostatic potential...
- Patent number 5,517,123
- Issue date May 14, 1996
- Analog Devices, Inc.
- Yang Zhao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Magnetic Field Sensor With Three-Dimensional Spiral Reset Coil
- Publication number 20170115363
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Leyue Jiang
- G01 - MEASURING TESTING
Information Patent Application
Method For Wafer-Level Chip Scale Package Testing
- Publication number 20170113929
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS FLOW SENSOR
- Publication number 20170038235
- Publication date Feb 9, 2017
- MEMSIC, INC.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Application
MEMS THERMAL FLOW SENSOR WITH COMPENSATION FOR FLUID COMPOSITION
- Publication number 20160245681
- Publication date Aug 25, 2016
- MEMSIC, INC.
- Thomas O. Maginnis
- G01 - MEASURING TESTING
Information Patent Application
THREE-DIMENSIONAL AIR MOUSE AND DISPLAY USED TOGETHER THEREWITH
- Publication number 20160062488
- Publication date Mar 3, 2016
- MEMSIC, INC.
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONOLITHIC THREE-AXIS MAGNETIC FIELD SENSOR
- Publication number 20150285873
- Publication date Oct 8, 2015
- MEMSIC, INC.
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR DATA FUSION OF A THREE-AXIS MAGNETOMETER A...
- Publication number 20150177020
- Publication date Jun 25, 2015
- MEMSIC, INC.
- Dong An
- G01 - MEASURING TESTING
Information Patent Application
MONOLITHIC SENSOR PACKAGE
- Publication number 20140130595
- Publication date May 15, 2014
- MEMSIC, INC.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOLDABLE SUBSTRATE
- Publication number 20130249542
- Publication date Sep 26, 2013
- Yang Zhao
- B32 - LAYERED PRODUCTS
Information Patent Application
MONOLITHIC TRI-AXIS AMR SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20120206137
- Publication date Aug 16, 2012
- MEMSIC, INC.
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
Z-AXIS CAPACITIVE ACCELEROMETER
- Publication number 20120125103
- Publication date May 24, 2012
- MEMSIC, INC.
- Leyue Jiang
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD OF SENSING ATTITUDE AND ANGULAR RATE USING A MAGN...
- Publication number 20110307213
- Publication date Dec 15, 2011
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR CALIBRATING A THREE-AXIS ACCELEROMETER
- Publication number 20110264393
- Publication date Oct 27, 2011
- Dong An
- G01 - MEASURING TESTING
Information Patent Application
MAGNETOMETER
- Publication number 20110227569
- Publication date Sep 22, 2011
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
ION DISCHARGE GYROSCOPE
- Publication number 20110005314
- Publication date Jan 13, 2011
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC SENSOR FOR USE WITH HAND-HELD DEVICES
- Publication number 20100161084
- Publication date Jun 24, 2010
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Location and path-map generation data acquisition and analysis systems
- Publication number 20100017124
- Publication date Jan 21, 2010
- MEMSIC, INC.
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System for sensing yaw rate using a magnetic field sensor and porta...
- Publication number 20080042973
- Publication date Feb 21, 2008
- Memsic, Inc.
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Devices, systems, and methods for controlling a shutter
- Publication number 20070280659
- Publication date Dec 6, 2007
- Memsic, Inc.
- Yang Zhao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Three-dimensional multi-chips and tri-axial sensors and methods of...
- Publication number 20070170228
- Publication date Jul 26, 2007
- Memsic Corporation
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Single chip tri-axis accelerometer
- Publication number 20070101813
- Publication date May 10, 2007
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Application
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Publication number 20060273430
- Publication date Dec 7, 2006
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level package for integrated circuits
- Publication number 20060216856
- Publication date Sep 28, 2006
- Memsic, Inc.
- Yang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package for integrated circuits
- Publication number 20060216857
- Publication date Sep 28, 2006
- Yang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and circuitry for thermal accelerometer signal conditioning
- Publication number 20050274180
- Publication date Dec 15, 2005
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Application
Z-axis thermal accelerometer
- Publication number 20050274187
- Publication date Dec 15, 2005
- Memsic, Inc.
- Yang Zhao
- G01 - MEASURING TESTING
Information Patent Application
Method of etching a deep trench in a substrate and method of fabric...
- Publication number 20020148807
- Publication date Oct 17, 2002
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

MEMS flow sensor

Method and apparatus for data fusion of a three-axis magnetometer a...

MEMS thermal flow sensor with compensation for fluid composition

Method for wafer-level chip scale package testing

Monolithic three-axis magnetic field sensor

System and method for calibrating a three-axis accelerometer

Z-axis capacitive accelerometer

Location and path-map generation data acquisition and analysis systems

Magnetometer

Ion discharge gyroscope

Magnetic sensor for use with hand-held devices

Three-dimensional multi-chips and tri-axial sensors and methods of...

Method of wafer-level packaging using low-aspect ratio through-wafe...

Devices, systems, and methods for controlling a shutter

Single chip tri-axis accelerometer

Z-axis thermal accelerometer

Method and circuitry for thermal accelerometer signal conditioning

Chip-scale package for integrated circuits

Wafer-level package for integrated circuits

Thermal convection accelerometer with closed-loop heater control

Method of etching a deep trench in a substrate and method of fabric...

Rotatable micromachined device for sensing magnetic fields

Rotatable micromachined device for sensing magnetic fields

Conductive plane beneath suspended microstructure

Rotatable micromachined device for sensing magnetic fields

Micromachined device packaged to reduce stiction

Micromechanical structure with textured surface and method for maki...

Conductive plane beneath suspended microstructure

Method and circuitry for calibrating a micromachined sensor

High sensitivity integrated micromechanical electrostatic potential...

Patents Applicationslast 30 patents

Magnetic Field Sensor With Three-Dimensional Spiral Reset Coil

Method For Wafer-Level Chip Scale Package Testing

MEMS FLOW SENSOR

MEMS THERMAL FLOW SENSOR WITH COMPENSATION FOR FLUID COMPOSITION

THREE-DIMENSIONAL AIR MOUSE AND DISPLAY USED TOGETHER THEREWITH

MONOLITHIC THREE-AXIS MAGNETIC FIELD SENSOR

METHOD AND APPARATUS FOR DATA FUSION OF A THREE-AXIS MAGNETOMETER A...

MONOLITHIC SENSOR PACKAGE

FOLDABLE SUBSTRATE

MONOLITHIC TRI-AXIS AMR SENSOR AND MANUFACTURING METHOD THEREOF

Z-AXIS CAPACITIVE ACCELEROMETER

SYSTEM AND METHOD OF SENSING ATTITUDE AND ANGULAR RATE USING A MAGN...

SYSTEM AND METHOD FOR CALIBRATING A THREE-AXIS ACCELEROMETER

MAGNETOMETER

ION DISCHARGE GYROSCOPE

MAGNETIC SENSOR FOR USE WITH HAND-HELD DEVICES

Location and path-map generation data acquisition and analysis systems

System for sensing yaw rate using a magnetic field sensor and porta...

Devices, systems, and methods for controlling a shutter

Three-dimensional multi-chips and tri-axial sensors and methods of...

Single chip tri-axis accelerometer

Method of wafer-level packaging using low-aspect ratio through-wafe...

Wafer-level package for integrated circuits

Chip-scale package for integrated circuits

Method and circuitry for thermal accelerometer signal conditioning

Z-axis thermal accelerometer

Method of etching a deep trench in a substrate and method of fabric...