YANGGYOO JUNG

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,057,408
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Chulwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 12,021,032
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with memory stack structure connected to logi...
- Patent number 11,935,867
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,721,679
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 11,694,961
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a substrate having two silicon laye...
- Patent number 11,145,637
- Issue date Oct 12, 2021
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD
- Publication number 20240421000
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079349
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063129
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Seok Geun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021577
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230335540
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20230326862
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230011941
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER SUBSTRATE
- Publication number 20220415772
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220189916
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220013475
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Chulwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20210391265
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210366884
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200312826
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS

YANGGYOO JUNG

Person

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor package having an interposer and method of manufactur...

Semiconductor package with memory stack structure connected to logi...

Semiconductor package and method of fabricating the same

Semiconductor package having an interposer and method of manufactur...

Semiconductor package including a substrate having two silicon laye...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING INTERPOSER SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME