Yann Civale

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having through-substrate vias
- Patent number 9,646,930
- Issue date May 9, 2017
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating through substrate vias
- Patent number 8,809,188
- Issue date Aug 19, 2014
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming 3D-interconnect structures with airgaps
- Patent number 8,647,920
- Issue date Feb 11, 2014
- IMEC VZW
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIAS
- Publication number 20150035168
- Publication date Feb 5, 2015
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING 3D-INTERCONNECT STRUCTURES WITH AIRGAPS
- Publication number 20120013022
- Publication date Jan 19, 2012
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING THROUGH SUBSTRATE VIAS
- Publication number 20110089572
- Publication date Apr 21, 2011
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS