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Yano Genki

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  • Beppu City, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FRONT SIDE LASER-BASED WAFER DICING
    • Publication number 20230260839
    • Publication date Aug 17, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20230040267
    • Publication date Feb 9, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20210183683
    • Publication date Jun 17, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT BACKSIDE METALLIZATION
    • Publication number 20210035932
    • Publication date Feb 4, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Hiroyuki SADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
    • Publication number 20200354214
    • Publication date Nov 12, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Kurt Peter Wachtler
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    INTEGRATED CIRCUIT BACKSIDE METALLIZATION
    • Publication number 20200203295
    • Publication date Jun 25, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Hiroyuki SADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FRONT SIDE LASER-BASED WAFER DICING
    • Publication number 20200176314
    • Publication date Jun 4, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20200075386
    • Publication date Mar 5, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20200051860
    • Publication date Feb 13, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE MATRIX EXPANDER WITH PARTITIONED SUBRING
    • Publication number 20200027772
    • Publication date Jan 23, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
    • Publication number 20190169019
    • Publication date Jun 6, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Kurt Peter Wachtler
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
    • Publication number 20180127266
    • Publication date May 10, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • Kurt Peter Wachtler
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-M...
    • Publication number 20170197823
    • Publication date Jul 13, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Kurt Peter Wachtler
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    WAFER DIE SEPARATION
    • Publication number 20160118300
    • Publication date Apr 28, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Genki Yano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Device With Wire Bond Connections
    • Publication number 20160035652
    • Publication date Feb 4, 2016
    • TEXAS INSTRUMENTS INCORPORATED
    • Genki Yano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIE SEPARATION
    • Publication number 20140339672
    • Publication date Nov 20, 2014
    • TEXAS INSTRUMENTS INCORPORATED
    • Genki Yano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING
    • Publication number 20140339673
    • Publication date Nov 20, 2014
    • TEXAS INSTRUMENTS INCORPORATED
    • Iriguchi Shoichi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING
    • Publication number 20130264686
    • Publication date Oct 10, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Iriguchi Shoichi
    • H01 - BASIC ELECTRIC ELEMENTS