Yanpei Deng

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Colloidal silica composite films for premetal dielectric applications
- Patent number 6,967,172
- Issue date Nov 22, 2005
- Honeywell International Inc.
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric films for narrow gap-fill applications
- Patent number 6,653,718
- Issue date Nov 25, 2003
- Honeywell International, Inc.
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric films for narrow gap-fill applications
- Patent number 6,444,495
- Issue date Sep 3, 2002
- Honeywell International, Inc.
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dielectric films for narrow gap-fill applications
- Publication number 20040228967
- Publication date Nov 18, 2004
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition for chemical mechanical planarization of copper, tantal...
- Publication number 20040046148
- Publication date Mar 11, 2004
- Fan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dielectric films for narrow gap-fill applications
- Publication number 20030087485
- Publication date May 8, 2003
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILMS FOR NARROW GAP-FILL APPLICATIONS
- Publication number 20020137260
- Publication date Sep 26, 2002
- Roger Leung
- H01 - BASIC ELECTRIC ELEMENTS