Yao-Hsiang LIANG

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transmission device and optical communication system
- Patent number 11,942,993
- Issue date Mar 26, 2024
- Molex, LLC
- Kuen-Ting Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for forming titanium nitride barrier with small surface grai...
- Patent number 11,854,980
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling electrochemical deposition to avoid defects...
- Patent number 11,603,602
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 11,417,700
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiving device
- Patent number 11,411,655
- Issue date Aug 9, 2022
- Molex, LLC
- Kuen-Ting Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming deep trench isolation in radiation sensing substr...
- Patent number 11,404,470
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 11,387,274
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with anti-acid layer and method for...
- Patent number 11,158,659
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yin-Shuo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling electrochemical deposition to avoid defects...
- Patent number 11,015,260
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,867,889
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Li-Yen Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,796,996
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 10,741,601
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming deep trench isolation in radiation sensing substr...
- Patent number 10,510,798
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stress-neutralized film stack and metho...
- Patent number 10,475,847
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 10,157,953
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming deep trench isolation in radiation sensing substr...
- Patent number 10,134,801
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,074,594
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Li-Yen Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure for step coverage improvement
- Patent number 9,991,204
- Issue date Jun 5, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Yen Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 9,966,304
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with recess
- Patent number 9,859,124
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Li-Yen Fang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Through via structure for step coverage improvement
- Patent number 9,711,454
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Yen Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 9,691,804
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with advanced pad structure resistant to plasm...
- Patent number 9,666,545
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with advanced pad structure resistant to plasm...
- Patent number 9,385,081
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation layer to improve capacitor breakdown voltage
- Patent number 9,196,674
- Issue date Nov 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao Hsiang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for copper interconnect
- Patent number 9,064,934
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with advanced pad structure resistant to plasm...
- Patent number 9,006,900
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for copper interconnect
- Patent number 8,872,342
- Issue date Oct 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming seed layer structure
- Patent number 8,778,801
- Issue date Jul 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Bin Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES
- Publication number 20240387379
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION
- Publication number 20240355870
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230402320
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN-NAN NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20230215802
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20230207381
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSMISSION DEVICE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20230034936
- Publication date Feb 2, 2023
- Molex, LLC
- Kuen-Ting TSAI
- G02 - OPTICS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20220415959
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...
- Publication number 20220359607
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
- Publication number 20220042197
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OPTICAL RECEIVING DEVICE
- Publication number 20210376934
- Publication date Dec 2, 2021
- Molex, LLC
- Kuen-Ting TSAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR CONTROLLING ELECTROCHEMICAL DEPOSITION TO AVOID DEFECTS...
- Publication number 20210238765
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSMITTER WITH MACH-ZEHNDER MODULATOR AND METHOD FOR OPER...
- Publication number 20210211202
- Publication date Jul 8, 2021
- Oplink Communications, LLC
- Kuen-Ting TSAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20200402916
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200373345
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHANG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
- Publication number 20200173051
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR CONTROLLING ELECTROCHEMICAL DEPOSITION TO AVOID DEFECTS...
- Publication number 20200176310
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Forming Deep Trench Isolation in Radiation Sensing Substr...
- Publication number 20200119081
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20200083278
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190148442
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHANG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...
- Publication number 20190043915
- Publication date Feb 7, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20190019743
- Publication date Jan 17, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- LI-YEN FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure with Anti-Acid Layer and Method for...
- Publication number 20180350855
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Shuo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20180261547
- Publication date Sep 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20170317134
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170294473
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHANG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIA STRUCTURE FOR STEP COVERAGE IMPROVEMENT
- Publication number 20170287841
- Publication date Oct 5, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Yen FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ANTI-ACID LAYER AND METHOD FOR...
- Publication number 20170170215
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Shuo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...
- Publication number 20170154917
- Publication date Jun 1, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIA STRUCTURE FOR STEP COVERAGE IMPROVEMENT
- Publication number 20170062343
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Yen FANG
- H01 - BASIC ELECTRIC ELEMENTS

Yao-Hsiang LIANG

Person

Patents Grantslast 30 patents

Method of forming semiconductor device

Optical transmission device and optical communication system

Method for forming titanium nitride barrier with small surface grai...

Method for controlling electrochemical deposition to avoid defects...

Image sensing device and manufacturing method thereof

Optical receiving device

Method of forming deep trench isolation in radiation sensing substr...

Method of forming semiconductor device

Semiconductor device structure with anti-acid layer and method for...

Method for controlling electrochemical deposition to avoid defects...

Method of manufacturing semiconductor structure

Semiconductor device and method of forming the same

Image sensing device and manufacturing method thereof

Method of forming deep trench isolation in radiation sensing substr...

Semiconductor device having stress-neutralized film stack and metho...

Image sensing device and manufacturing method thereof

Method of forming deep trench isolation in radiation sensing substr...

Semiconductor structure and manufacturing method thereof

Through via structure for step coverage improvement

Method for forming interconnect structure

Method of manufacturing semiconductor device with recess

Through via structure for step coverage improvement

Image sensing device and manufacturing method thereof

Semiconductor device with advanced pad structure resistant to plasm...

Semiconductor device with advanced pad structure resistant to plasm...

Insulation layer to improve capacitor breakdown voltage

Barrier layer for copper interconnect

Semiconductor device with advanced pad structure resistant to plasm...

Barrier layer for copper interconnect

Method for forming seed layer structure

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES

Method of Forming Semiconductor Device

CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CONDUCTIVE STRUCTURES AND METHODS OF FABRICATION THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

OPTICAL TRANSMISSION DEVICE AND OPTICAL COMMUNICATION SYSTEM

Method of Forming Semiconductor Device

METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...

ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING

OPTICAL RECEIVING DEVICE

METHOD FOR CONTROLLING ELECTROCHEMICAL DEPOSITION TO AVOID DEFECTS...

OPTICAL TRANSMITTER WITH MACH-ZEHNDER MODULATOR AND METHOD FOR OPER...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF

ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING

METHOD FOR CONTROLLING ELECTROCHEMICAL DEPOSITION TO AVOID DEFECTS...

Method of Forming Deep Trench Isolation in Radiation Sensing Substr...

Method of Forming Semiconductor Device

IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Semiconductor Device Structure with Anti-Acid Layer and Method for...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE

IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF

THROUGH VIA STRUCTURE FOR STEP COVERAGE IMPROVEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH ANTI-ACID LAYER AND METHOD FOR...

METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTR...

THROUGH VIA STRUCTURE FOR STEP COVERAGE IMPROVEMENT