Yao Hsin Feng

Person

Hualien City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an optical device and a method of maki...
- Patent number 7,229,846
- Issue date Jun 12, 2007
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer package and manufacturing method thereof
- Patent number 7,122,459
- Issue date Oct 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer
- Patent number 7,115,484
- Issue date Oct 3, 2006
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and testing method for the same
- Patent number 6,768,332
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering Inc.
- Yueh Lung Lin
- G01 - MEASURING TESTING
Information Patent Grant
Heat-spread substrate
- Patent number 6,483,187
- Issue date Nov 19, 2002
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser method for forming vias
- Patent number 6,429,049
- Issue date Aug 6, 2002
- Advanced Semiconductor Engineering, Inc.
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press plate of wire bond checking system
- Patent number 6,392,424
- Issue date May 21, 2002
- Advanced Semiconductor Engineering Inc.
- Chin-Chen Wang
- G01 - MEASURING TESTING
Information Patent Grant
Base for wire bond checking
- Patent number 6,172,318
- Issue date Jan 9, 2001
- Advanced Semiconductor Engineering Inc.
- Chin-Chen Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Process for testing IC wafer
- Publication number 20070046314
- Publication date Mar 1, 2007
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer package and manufacturing method thereof
- Publication number 20060286791
- Publication date Dec 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of dicing a wafer
- Publication number 20050130392
- Publication date Jun 16, 2005
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for testing IC wafer
- Publication number 20050019965
- Publication date Jan 27, 2005
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer package and manufacturing method thereof
- Publication number 20040266162
- Publication date Dec 30, 2004
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with marking film and manufacturing method th...
- Publication number 20040082103
- Publication date Apr 29, 2004
- Advanced Semiconductor Engineering, Inc.
- Yao-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and testing method for the same
- Publication number 20040021479
- Publication date Feb 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Yueh Lung Lin
- G01 - MEASURING TESTING
Information Patent Application
Cavity down ball grid array packaging structure
- Publication number 20020195721
- Publication date Dec 26, 2002
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS

Yao Hsin Feng

Person

Patents Grantslast 30 patents

Semiconductor package having an optical device and a method of maki...

Semiconductor wafer package and manufacturing method thereof

Method of dicing a wafer

Semiconductor wafer and testing method for the same

Heat-spread substrate

Laser method for forming vias

Press plate of wire bond checking system

Base for wire bond checking

Patents Applicationslast 30 patents

Process for testing IC wafer

Semiconductor wafer package and manufacturing method thereof

Method of dicing a wafer

Process for testing IC wafer

Semiconductor wafer package and manufacturing method thereof

Semiconductor package with marking film and manufacturing method th...

Semiconductor wafer and testing method for the same

Cavity down ball grid array packaging structure