Yao Huang Huang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Interposer for semiconductor package
- Patent number 8,772,921
- Issue date Jul 8, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer for semiconductor package
- Patent number 8,115,292
- Issue date Feb 14, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20120104628
- Publication date May 3, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20100109142
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR