Yao-Kai Chuang

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked type chip package structure including a chip package and a...
- Patent number 7,834,469
- Issue date Nov 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...
- Publication number 20090278243
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE
- Publication number 20090278242
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090267210
- Publication date Oct 29, 2009
- Yao-Kai CHUANG
- H01 - BASIC ELECTRIC ELEMENTS