YAO LIU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Gel composite cathode for solid-state batteries and methods of manu...
- Patent number 11,777,145
- Issue date Oct 3, 2023
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
- Patent number 10,134,698
- Issue date Nov 20, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Fucheng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and related manufacturing method
- Patent number 9,343,435
- Issue date May 17, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERLAYERS FOR CATHODE/SOLID ELECTROLYTE INTERFACES IN SOLID-STATE...
- Publication number 20240097114
- Publication date Mar 21, 2024
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED CATHODE FOR HIGH-VOLTAGE LITHIUM-ION BATTERY AND METHODS O...
- Publication number 20240038984
- Publication date Feb 1, 2024
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP-EUTECTIC-SOLVENT-BASED (DES) ELECTROLYTES FOR CATHODE/SOLID EL...
- Publication number 20230344010
- Publication date Oct 26, 2023
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED CATHODE FOR HIGH-VOLTAGE LITHIUM-ION BATTERY AND METHODS O...
- Publication number 20230223518
- Publication date Jul 13, 2023
- Corning Incorporated
- Michael Edward Badding
- C01 - INORGANIC CHEMISTRY
Information Patent Application
GEL COMPOSITE CATHODE FOR SOLID-STATE BATTERIES AND METHODS OF MANU...
- Publication number 20210408591
- Publication date Dec 30, 2021
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...
- Publication number 20170084557
- Publication date Mar 23, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- FUCHENG CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
- Publication number 20150187736
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Gel composite cathode for solid-state batteries and methods of manu...

Bonding pad structure, bonding ring structure, and MEMS device pack...

Semiconductor device and related manufacturing method

Patents Applicationslast 30 patents

INTERLAYERS FOR CATHODE/SOLID ELECTROLYTE INTERFACES IN SOLID-STATE...

MODIFIED CATHODE FOR HIGH-VOLTAGE LITHIUM-ION BATTERY AND METHODS O...

DEEP-EUTECTIC-SOLVENT-BASED (DES) ELECTROLYTES FOR CATHODE/SOLID EL...

MODIFIED CATHODE FOR HIGH-VOLTAGE LITHIUM-ION BATTERY AND METHODS O...

GEL COMPOSITE CATHODE FOR SOLID-STATE BATTERIES AND METHODS OF MANU...

BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...

SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD