Yao-Sheng Lee

Person

Tampa, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilevel memory stack structure with tapered inter-tier joint reg...
- Patent number 11,621,277
- Issue date Apr 4, 2023
- SanDisk Technologies LLC
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including discrete charge storage e...
- Patent number 11,469,241
- Issue date Oct 11, 2022
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including having metal organic framework inter...
- Patent number 11,430,736
- Issue date Aug 30, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing metal-organic framework...
- Patent number 11,387,250
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including discrete charge storage e...
- Patent number 11,387,244
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing metal-organic framework inter-line...
- Patent number 11,296,028
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including an inter-tier etch stop l...
- Patent number 11,296,101
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Yao-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including molybdenum word lines and...
- Patent number 11,244,953
- Issue date Feb 8, 2022
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing metal-organic framework bonding dielectr...
- Patent number 11,171,097
- Issue date Nov 9, 2021
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flat NAND memory device having high mobility chan...
- Patent number 10,950,629
- Issue date Mar 16, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 10,847,408
- Issue date Nov 24, 2020
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having multilayer word lines contai...
- Patent number 10,741,572
- Issue date Aug 11, 2020
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flat NAND memory device having high mobility chan...
- Patent number 10,700,086
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with semicircular metal-semiconduct...
- Patent number 10,622,368
- Issue date Apr 14, 2020
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support pillar structures for leakage reduction in a three-dimensio...
- Patent number 10,475,879
- Issue date Nov 12, 2019
- SanDisk Technologies LLC
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene process for forming three-dimensional cross rail phase ch...
- Patent number 10,468,596
- Issue date Nov 5, 2019
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with thickened word lines in terrac...
- Patent number 10,461,163
- Issue date Oct 29, 2019
- SanDisk Technologies LLC
- Senaka Krishna Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having direct source contact and me...
- Patent number 10,438,964
- Issue date Oct 8, 2019
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support pillar structures for leakage reduction in a three-dimensio...
- Patent number 10,381,434
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier memory device with through-stack peripheral contact via...
- Patent number 10,269,620
- Issue date Apr 23, 2019
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional array device having a metal containing barrier an...
- Patent number 10,262,945
- Issue date Apr 16, 2019
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with silicided word lines, air gap...
- Patent number 10,256,247
- Issue date Apr 9, 2019
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional cross rail phase change memory device and method...
- Patent number 10,199,434
- Issue date Feb 5, 2019
- SanDisk Technologies LLC
- Yao-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt-containing conductive layers for control gate electrodes in...
- Patent number 10,128,261
- Issue date Nov 13, 2018
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices containing inter-tier dummy memory...
- Patent number 10,056,399
- Issue date Aug 21, 2018
- SanDisk Technologies LLC
- Xiying Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with leakage reducing support pilla...
- Patent number 10,014,316
- Issue date Jul 3, 2018
- SanDisk Technologies LLC
- Fabo Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ridged word lines for increasing control gate lengths in a three-di...
- Patent number 9,893,081
- Issue date Feb 13, 2018
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional NAND device having dummy memory holes and method...
- Patent number 9,887,207
- Issue date Feb 6, 2018
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a lateral source contact...
- Patent number 9,824,966
- Issue date Nov 21, 2017
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HAVING METAL ORGANIC FRAMEWORK INTER...
- Publication number 20220059462
- Publication date Feb 24, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...
- Publication number 20210327889
- Publication date Oct 21, 2021
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...
- Publication number 20210327890
- Publication date Oct 21, 2021
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AN INTER-TIER ETCH STOP L...
- Publication number 20210305266
- Publication date Sep 30, 2021
- SANDISK TECHNOLOGIES LLC
- Yao-Sheng Lee
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MOLYBDENUM WORD LINES AND...
- Publication number 20210265372
- Publication date Aug 26, 2021
- SANDISK TECHNOLOGIES LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING DIELECTR...
- Publication number 20210233881
- Publication date Jul 29, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONTAINING METAL-ORGANIC FRAMEWORK INTER-LINE...
- Publication number 20210193585
- Publication date Jun 24, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING METAL-ORGANIC FRAMEWORK...
- Publication number 20210193674
- Publication date Jun 24, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...
- Publication number 20210066347
- Publication date Mar 4, 2021
- SANDISK TECHNOLOGIES LLC
- Monica TITUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING HIGH MOBILITY CHAN...
- Publication number 20200279868
- Publication date Sep 3, 2020
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE-COMPENSATED BONDED STRUCTURE INCLUDING A SUPPORT CHIP AND A...
- Publication number 20200251443
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Senaka KANAKAMEDALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE-COMPENSATED BONDED STRUCTURE INCLUDING A SUPPORT CHIP AND A...
- Publication number 20200251374
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING HIGH MOBILITY CHAN...
- Publication number 20200006376
- Publication date Jan 2, 2020
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEMICIRCULAR METAL-SEMICONDUCT...
- Publication number 20190371803
- Publication date Dec 5, 2019
- SANDISK TECHNOLOGIES LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE PROCESS FOR FORMING THREE-DIMENSIONAL CROSS RAIL PHASE CH...
- Publication number 20190259946
- Publication date Aug 22, 2019
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THICKENED WORD LINES IN TERRAC...
- Publication number 20190148506
- Publication date May 16, 2019
- SanDisk Technologies LLC
- Senaka Krishna KANAKAMEDALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DIRECT SOURCE CONTACT AND ME...
- Publication number 20180374866
- Publication date Dec 27, 2018
- SanDisk Technologies LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...
- Publication number 20180331117
- Publication date Nov 15, 2018
- SanDisk Technologies LLC
- Monica TITUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES CONTAINING INTER-TIER DUMMY MEMORY...
- Publication number 20180182771
- Publication date Jun 28, 2018
- SanDisk Technologies LLC
- Xiying Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE
- Publication number 20180175054
- Publication date Jun 21, 2018
- SanDisk Technologies LLC
- Ashish Baraskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL ARRAY DEVICE HAVING A METAL CONTAINING BARRIER AN...
- Publication number 20180151497
- Publication date May 31, 2018
- SanDisk Technologies LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LEAKAGE REDUCING SUPPORT PILLA...
- Publication number 20180108671
- Publication date Apr 19, 2018
- SanDisk Technologies LLC
- Fabo YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEMICIRCULAR METAL-SEMICONDUCT...
- Publication number 20180040623
- Publication date Feb 8, 2018
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIDGED WORD LINES FOR INCREASING CONTROL GATE LENGTHS IN A THREE-DI...
- Publication number 20180040627
- Publication date Feb 8, 2018
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE
- Publication number 20180033798
- Publication date Feb 1, 2018
- SanDisk Technologies LLC
- Ashish Baraskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTILAYER WORD LINES CONTAI...
- Publication number 20170352669
- Publication date Dec 7, 2017
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT-CONTAINING CONDUCTIVE LAYERS FOR CONTROL GATE ELECTRODES IN...
- Publication number 20170287925
- Publication date Oct 5, 2017
- SANDISK TECHNOLOGIES INC.
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...
- Publication number 20170236746
- Publication date Aug 17, 2017
- SanDisk Technologies LLC
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
ROBUST NUCLEATION LAYERS FOR ENHANCED FLUORINE PROTECTION AND STRES...
- Publication number 20170125538
- Publication date May 4, 2017
- SANDISK TECHNOLOGIES INC.
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES CONTAINING MEMORY BLOCK BRIDGES
- Publication number 20170047334
- Publication date Feb 16, 2017
- SANDISK TECHNOLOGIES INC.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Yao-Sheng Lee

Person

Patents Grantslast 30 patents

Multilevel memory stack structure with tapered inter-tier joint reg...

Three-dimensional memory device including discrete charge storage e...

Semiconductor device including having metal organic framework inter...

Three-dimensional memory device containing metal-organic framework...

Three-dimensional memory device including discrete charge storage e...

Semiconductor device containing metal-organic framework inter-line...

Three-dimensional memory device including an inter-tier etch stop l...

Three-dimensional memory device including molybdenum word lines and...

Bonded assembly containing metal-organic framework bonding dielectr...

Warpage-compensated bonded structure including a support chip and a...

Three-dimensional flat NAND memory device having high mobility chan...

Warpage-compensated bonded structure including a support chip and a...

Three-dimensional memory device having multilayer word lines contai...

Three-dimensional flat NAND memory device having high mobility chan...

Three-dimensional memory device with semicircular metal-semiconduct...

Support pillar structures for leakage reduction in a three-dimensio...

Damascene process for forming three-dimensional cross rail phase ch...

Three-dimensional memory device with thickened word lines in terrac...

Three-dimensional memory device having direct source contact and me...

Support pillar structures for leakage reduction in a three-dimensio...

Multi-tier memory device with through-stack peripheral contact via...

Three-dimensional array device having a metal containing barrier an...

Three-dimensional memory device with silicided word lines, air gap...

Three-dimensional cross rail phase change memory device and method...

Cobalt-containing conductive layers for control gate electrodes in...

Three-dimensional memory devices containing inter-tier dummy memory...

Three-dimensional memory device with leakage reducing support pilla...

Ridged word lines for increasing control gate lengths in a three-di...

Three dimensional NAND device having dummy memory holes and method...

Three-dimensional memory device containing a lateral source contact...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING HAVING METAL ORGANIC FRAMEWORK INTER...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AN INTER-TIER ETCH STOP L...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MOLYBDENUM WORD LINES AND...

BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING DIELECTR...

SEMICONDUCTOR DEVICE CONTAINING METAL-ORGANIC FRAMEWORK INTER-LINE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING METAL-ORGANIC FRAMEWORK...

MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...

THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING HIGH MOBILITY CHAN...

WARPAGE-COMPENSATED BONDED STRUCTURE INCLUDING A SUPPORT CHIP AND A...

WARPAGE-COMPENSATED BONDED STRUCTURE INCLUDING A SUPPORT CHIP AND A...

THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING HIGH MOBILITY CHAN...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEMICIRCULAR METAL-SEMICONDUCT...

DAMASCENE PROCESS FOR FORMING THREE-DIMENSIONAL CROSS RAIL PHASE CH...

THREE-DIMENSIONAL MEMORY DEVICE WITH THICKENED WORD LINES IN TERRAC...

THREE-DIMENSIONAL MEMORY DEVICE HAVING DIRECT SOURCE CONTACT AND ME...

MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...

THREE-DIMENSIONAL MEMORY DEVICES CONTAINING INTER-TIER DUMMY MEMORY...

NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE

THREE-DIMENSIONAL ARRAY DEVICE HAVING A METAL CONTAINING BARRIER AN...

THREE-DIMENSIONAL MEMORY DEVICE WITH LEAKAGE REDUCING SUPPORT PILLA...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEMICIRCULAR METAL-SEMICONDUCT...

RIDGED WORD LINES FOR INCREASING CONTROL GATE LENGTHS IN A THREE-DI...

NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE

THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTILAYER WORD LINES CONTAI...

COBALT-CONTAINING CONDUCTIVE LAYERS FOR CONTROL GATE ELECTRODES IN...

MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...

ROBUST NUCLEATION LAYERS FOR ENHANCED FLUORINE PROTECTION AND STRES...

THREE-DIMENSIONAL MEMORY DEVICES CONTAINING MEMORY BLOCK BRIDGES