Yao-Tong Lai

Person

Yilan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 12,011,859
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 11,731,327
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus, manufacturing method of molded semiconductor dev...
- Patent number 11,446,851
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 11,309,226
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,283,377
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...
- Publication number 20240293962
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20230347561
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20220362975
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20220238407
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20210193544
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...
- Publication number 20200338796
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139787
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Yao-Tong Lai

Person

Patents Grantslast 30 patents

Molding apparatus and manufacturing method of molded semiconductor...

Molding apparatus and manufacturing method of molded semiconductor...

Molding apparatus, manufacturing method of molded semiconductor dev...

Three-dimensional integrated circuit structures and methods of form...

Integrated fan-out package and manufacturing method thereof

Patents Applicationslast 30 patents

MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF