Yaojian Leng

Person

Scarborough, ME, US

People

Patents Grantslast 30 patents

Information Patent Grant
Monitoring copper corrosion in an integrated circuit device
- Patent number 12,130,241
- Issue date Oct 29, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...
- Patent number 12,021,115
- Issue date Jun 25, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module including a cup-shaped...
- Patent number 12,015,052
- Issue date Jun 18, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive random access memory (RRAM) cells and methods of construc...
- Patent number 12,010,932
- Issue date Jun 11, 2024
- Microchip Technology Incorporated
- Yaojian Leng
Information Patent Grant
Integrated circuit package module including a bonding system
- Patent number 11,935,824
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric random access memory (FRAM) capacitors and methods of...
- Patent number 11,937,434
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) having a TFR element providing a diffusion...
- Patent number 11,824,079
- Issue date Nov 21, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) with displacement-plated TFR heads
- Patent number 11,824,080
- Issue date Nov 21, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming integrated inductor-capacitor oscillators an...
- Patent number 11,804,803
- Issue date Oct 31, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module
- Patent number 11,769,793
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal-insulator-metal (MIM) capacitor
- Patent number 11,769,722
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 11,735,516
- Issue date Aug 22, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric random access memory (FRAM) capacitors and methods of...
- Patent number 11,729,993
- Issue date Aug 15, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with integrated inductor having cor...
- Patent number 11,723,222
- Issue date Aug 8, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal (MIM) capacitor
- Patent number 11,715,757
- Issue date Aug 1, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor with a stacked metal wire
- Patent number 11,670,583
- Issue date Jun 6, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) module
- Patent number 11,670,439
- Issue date Jun 6, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) with improved contacts
- Patent number 11,626,474
- Issue date Apr 11, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit e-fuse having an e-fuse element providing a diff...
- Patent number 11,600,566
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for monitoring copper corrosion in an integrate...
- Patent number 11,573,189
- Issue date Feb 7, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor and thin-film resistor (TFR)...
- Patent number 11,552,011
- Issue date Jan 10, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor
- Patent number 11,545,428
- Issue date Jan 3, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal (MIM) capacitor
- Patent number 11,545,544
- Issue date Jan 3, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor
- Patent number 11,101,208
- Issue date Aug 24, 2021
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for making integrated inductors and related semiconducto...
- Patent number 11,094,628
- Issue date Aug 17, 2021
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) formed under a metal layer and method of f...
- Patent number 10,818,748
- Issue date Oct 27, 2020
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench DMOS transistor with reduced gate-to-drain capacitance
- Patent number 10,741,687
- Issue date Aug 11, 2020
- Texas Instruments Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum compatible thin-film resistor (TFR) and manufacturing methods
- Patent number 10,658,453
- Issue date May 19, 2020
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing damascene thin-film resistor (TFR) in poly-...
- Patent number 10,643,887
- Issue date May 5, 2020
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT STRUCTURE INCLUDING A RESIS...
- Publication number 20240215464
- Publication date Jun 27, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITORS WITH CURVED ELECTRODE
- Publication number 20240170529
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITORS AND TRENCHES
- Publication number 20240170390
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A PARTIALLY SILICIDED ELEMENT
- Publication number 20240087886
- Publication date Mar 14, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RESISTOR
- Publication number 20240088201
- Publication date Mar 14, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CAPACITOR MODULE INCLUDING A STACKED METAL-INSULATOR-METAL (M...
- Publication number 20240006472
- Publication date Jan 4, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CAPACITOR MODULE INCLUDING A NESTED METAL-INSULATOR-METAL (MI...
- Publication number 20230420495
- Publication date Dec 28, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE
- Publication number 20230395649
- Publication date Dec 7, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM RESISTOR (TFR) MODULE INCLUDING A TFR ELEMENT FORMED IN A...
- Publication number 20230361159
- Publication date Nov 9, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring
- Publication number 20230352398
- Publication date Nov 2, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) CAPACITORS AND METHODS OF...
- Publication number 20230345735
- Publication date Oct 26, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH A STACKED METAL WIRE
- Publication number 20230268269
- Publication date Aug 24, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE WITH OUTER ELECTRODE E...
- Publication number 20230268376
- Publication date Aug 24, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE WITH DIELECTRIC SIDEWA...
- Publication number 20230268380
- Publication date Aug 24, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20230260938
- Publication date Aug 17, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INCLUDING AN INSULATOR CUP AN...
- Publication number 20230207614
- Publication date Jun 29, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE INCLUDING A CUP-SHAPED...
- Publication number 20230207615
- Publication date Jun 29, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING COPPER CORROSION IN AN INTEGRATED CIRCUIT DEVICE
- Publication number 20230160836
- Publication date May 25, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH INDUCTOR WIRE FORMED IN AN INTEGRATED CIRC...
- Publication number 20230129684
- Publication date Apr 27, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR EL...
- Publication number 20230128990
- Publication date Apr 27, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR
- Publication number 20230096226
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM
- Publication number 20230099856
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE
- Publication number 20230082867
- Publication date Mar 16, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL-INSULATOR-METAL (MIM) CAPACITOR
- Publication number 20230079474
- Publication date Mar 16, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE INCLUDING A METAL-INSULATOR-METAL (MIM...
- Publication number 20230081749
- Publication date Mar 16, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE DEVICE WITH A CUP-SHAPED INSULATOR
- Publication number 20230021192
- Publication date Jan 19, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM RESISTOR (TFR) MODULE
- Publication number 20230013766
- Publication date Jan 19, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE (CNT) MEMORY CELL ELEMENT AND METHODS OF CONSTRUCTION
- Publication number 20220399402
- Publication date Dec 15, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) CAPACITORS AND METHODS OF...
- Publication number 20220399352
- Publication date Dec 15, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE RANDOM ACCESS MEMORY (RRAM) CELLS AND METHODS OF CONSTRUC...
- Publication number 20220393105
- Publication date Dec 8, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS

Yaojian Leng

Person

Patents Grantslast 30 patents

Monitoring copper corrosion in an integrated circuit device

Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...

Metal-insulator-metal (MIM) capacitor module including a cup-shaped...

Resistive random access memory (RRAM) cells and methods of construc...

Integrated circuit package module including a bonding system

Ferroelectric random access memory (FRAM) capacitors and methods of...

Thin-film resistor (TFR) having a TFR element providing a diffusion...

Thin-film resistor (TFR) with displacement-plated TFR heads

Techniques for forming integrated inductor-capacitor oscillators an...

Metal-insulator-metal (MIM) capacitor module

Method of forming a metal-insulator-metal (MIM) capacitor

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Ferroelectric random access memory (FRAM) capacitors and methods of...

Integrated circuit (IC) package with integrated inductor having cor...

Three-dimensional metal-insulator-metal (MIM) capacitor

Integrated circuit bond pad with multi-material toothed structure

Integrated inductor with a stacked metal wire

Thin-film resistor (TFR) module

Thin-film resistor (TFR) with improved contacts

Integrated circuit e-fuse having an e-fuse element providing a diff...

Systems and methods for monitoring copper corrosion in an integrate...

Metal-insulator-metal (MIM) capacitor and thin-film resistor (TFR)...

Metal-insulator-metal (MIM) capacitor

Three-dimensional metal-insulator-metal (MIM) capacitor

Metal-insulator-metal (MIM) capacitor

Techniques for making integrated inductors and related semiconducto...

Thin-film resistor (TFR) formed under a metal layer and method of f...

Trench DMOS transistor with reduced gate-to-drain capacitance

Aluminum compatible thin-film resistor (TFR) and manufacturing methods

Method of manufacturing damascene thin-film resistor (TFR) in poly-...

Patents Applicationslast 30 patents

METHOD OF FORMING AN INTEGRATED CIRCUIT STRUCTURE INCLUDING A RESIS...

METAL-INSULATOR-METAL (MIM) CAPACITORS WITH CURVED ELECTRODE

THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITORS AND TRENCHES

FORMING A PARTIALLY SILICIDED ELEMENT

INTEGRATED RESISTOR

MULTI-CAPACITOR MODULE INCLUDING A STACKED METAL-INSULATOR-METAL (M...

MULTI-CAPACITOR MODULE INCLUDING A NESTED METAL-INSULATOR-METAL (MI...

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE

THIN-FILM RESISTOR (TFR) MODULE INCLUDING A TFR ELEMENT FORMED IN A...

Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring

FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) CAPACITORS AND METHODS OF...

INTEGRATED INDUCTOR WITH A STACKED METAL WIRE

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE WITH OUTER ELECTRODE E...

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE WITH DIELECTRIC SIDEWA...

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

METAL-INSULATOR-METAL (MIM) CAPACITOR INCLUDING AN INSULATOR CUP AN...

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE INCLUDING A CUP-SHAPED...

MONITORING COPPER CORROSION IN AN INTEGRATED CIRCUIT DEVICE

INTEGRATED INDUCTOR WITH INDUCTOR WIRE FORMED IN AN INTEGRATED CIRC...

INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR EL...

THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR

INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE

METHOD OF FORMING A METAL-INSULATOR-METAL (MIM) CAPACITOR

INTEGRATED CIRCUIT STRUCTURE INCLUDING A METAL-INSULATOR-METAL (MIM...

ANTI-FUSE DEVICE WITH A CUP-SHAPED INSULATOR

THIN-FILM RESISTOR (TFR) MODULE

CARBON NANOTUBE (CNT) MEMORY CELL ELEMENT AND METHODS OF CONSTRUCTION

FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) CAPACITORS AND METHODS OF...

RESISTIVE RANDOM ACCESS MEMORY (RRAM) CELLS AND METHODS OF CONSTRUC...