Yaojian Lin

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 11,257,729
- Issue date Feb 22, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial adhesive ove...
- Patent number 10,998,248
- Issue date May 4, 2021
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 10,804,153
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 10,790,158
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 10,622,293
- Issue date Apr 14, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing encapsulant along sides and surface edge of se...
- Patent number 10,515,828
- Issue date Dec 24, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 10,446,459
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wire studs as vertical i...
- Patent number 10,446,523
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dual fan-out semiconduct...
- Patent number 10,418,298
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 10,388,612
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming supporting layer over se...
- Patent number 10,297,518
- Issue date May 21, 2019
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using substrate having base and...
- Patent number 10,242,948
- Issue date Mar 26, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming shielding layer over int...
- Patent number 10,211,183
- Issue date Feb 19, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 10,204,866
- Issue date Feb 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer-level interconnect...
- Patent number 10,204,879
- Issue date Feb 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,189,702
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
- Patent number 10,192,796
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 10,192,801
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 10,181,423
- Issue date Jan 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 10,177,010
- Issue date Jan 8, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20200006177
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
- Publication number 20190109015
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20190109048
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294236
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294235
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20170330840
- Publication date Nov 16, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20170297903
- Publication date Oct 19, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20170278765
- Publication date Sep 28, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20170271305
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20170133270
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20170098612
- Publication date Apr 6, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Substrate Having Base and...
- Publication number 20170098610
- Publication date Apr 6, 2017
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
- Publication number 20170084526
- Publication date Mar 23, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna In Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20170033062
- Publication date Feb 2, 2017
- STATS ChipPAC Pte Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20170011936
- Publication date Jan 12, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
- Publication number 20160351419
- Publication date Dec 1, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wire Studs as Vertical I...
- Publication number 20160336299
- Publication date Nov 17, 2016
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
- Publication number 20160300797
- Publication date Oct 13, 2016
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20160300799
- Publication date Oct 13, 2016
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Supporting Layer Over Se...
- Publication number 20160276238
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20160276258
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
- Publication number 20160276237
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stacked Vias Within Inte...
- Publication number 20160276239
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Build-Up Interconnect St...
- Publication number 20160276232
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Yaojian Lin

Person

Patents Grantslast 30 patents

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device with encapsulant deposited along sides and sur...

Integrated circuit packaging system with shielding and method of ma...

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming sacrificial adhesive ove...

Semiconductor device and method to minimize stress on stack via

Semiconductor device and method of balancing surfaces of an embedde...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method for forming a low profile embedded...

Method of depositing encapsulant along sides and surface edge of se...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming wire studs as vertical i...

Semiconductor device and method of forming dual fan-out semiconduct...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of forming supporting layer over se...

Semiconductor device and method of using substrate having base and...

Semiconductor device and method of forming an embedded SoP fan-out...

Semiconductor device and method of forming shielding layer over int...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device and method of forming wafer-level interconnect...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of forming dual-sided interconnect...

Semiconductor device and method of forming vertical interconnect st...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of balancing surfaces of an embedde...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Balancing Surfaces of an Embedde...

Semiconductor Device and Method of Using a Standardized Carrier in...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

Semiconductor Device and Method of Forming Microelectromechanical S...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Using Substrate Having Base and...

Semiconductor Device and Method of Forming Repassivation Layer for...

Antenna In Embedded Wafer-Level Ball-Grid Array Package

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method of Balancing Surfaces of an Embedde...

Semiconductor Device and Method of Forming Wire Studs as Vertical I...

Double-Sided Semiconductor Package and Dual-Mold Method of Making Same

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming Supporting Layer Over Se...

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

Semiconductor Device and Method to Minimize Stress on Stack Via

Semiconductor Device and Method of Forming Stacked Vias Within Inte...

Semiconductor Device and Method of Forming Build-Up Interconnect St...