TREA

Yaping GE

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip chip bonding device and bonding method
    • Patent number 10,903,105
    • Issue date Jan 26, 2021
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Feibiao Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip bonding apparatus and method
    • Patent number 10,748,800
    • Issue date Aug 18, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Yuebin Zhu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    FLIP CHIP BONDING DEVICE AND BONDING METHOD
    • Publication number 20200013656
    • Publication date Jan 9, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO.,LTD.
    • Feibiao CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP BONDING APPARATUS AND METHOD
    • Publication number 20190088516
    • Publication date Mar 21, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Yuebin ZHU
    • H01 - BASIC ELECTRIC ELEMENTS