Yaping Hua

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Wuxi, CN

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Patents Grantslast 30 patents

Information Patent Grant
Leakage detection method using micromachined-thermal-convection acc...
- Patent number 8,011,226
- Issue date Sep 6, 2011
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Grant
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Patent number 7,495,462
- Issue date Feb 24, 2009
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Single chip tri-axis accelerometer
- Patent number 7,424,826
- Issue date Sep 16, 2008
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Grant
Method of etching a deep trench in a substrate and method of fabric...
- Patent number 6,712,983
- Issue date Mar 30, 2004
- Memsic, Inc.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Leakage detection method using micromachined-thermal-convection acc...
- Publication number 20100050747
- Publication date Mar 4, 2010
- MEMSIC, INC.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Application
Single chip tri-axis accelerometer
- Publication number 20070101813
- Publication date May 10, 2007
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Application
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Publication number 20060273430
- Publication date Dec 7, 2006
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of etching a deep trench in a substrate and method of fabric...
- Publication number 20020148807
- Publication date Oct 17, 2002
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY