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Yaping Wang

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer dicing method
    • Patent number 10,658,239
    • Issue date May 19, 2020
    • Semiconductor Manufacturing International (Beijing) Corp.
    • Lihui Lu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20230139773
    • Publication date May 4, 2023
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Xinxing BAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DICING METHOD
    • Publication number 20190181045
    • Publication date Jun 13, 2019
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Lihui Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FOLDABLE ELECTRICAL DEVICES
    • Publication number 20100157548
    • Publication date Jun 24, 2010
    • INVENTEC APPLIANCES (SHANGHAI) CO., LTD.
    • Yaping Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR