Yaping Zhou

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structures to improve signal integrity within stack...
- Patent number 11,600,554
- Issue date Mar 7, 2023
- NVIDIA Corporation
- Walker J. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance and capacitance balancing systems and methods
- Patent number 10,685,925
- Issue date Jun 16, 2020
- NVIDIA Corporation
- Jim Dobbins
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Cross talk reduction differential cross over routing systems and me...
- Patent number 10,600,730
- Issue date Mar 24, 2020
- NVIDIA Corporation
- Jim Dobbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors for integrated voltage regulators
- Patent number 9,831,198
- Issue date Nov 28, 2017
- NVIDIA Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filtering high speed signals
- Patent number 9,306,776
- Issue date Apr 5, 2016
- NVIDIA Corporation
- Yaping Zhou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reducing impedance discontinuity in packages
- Patent number 8,791,372
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,742,565
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to reduce impedance discontinuity in packages
- Patent number 8,440,917
- Issue date May 14, 2013
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,399,981
- Issue date Mar 19, 2013
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to improve coreless package connections
- Patent number 8,338,949
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array with improved single-ended and differential signal...
- Patent number 8,338,948
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to improve coreless package connections
- Patent number 8,222,739
- Issue date Jul 17, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage controlled on-chip decoupling capacitance to mitigate power...
- Patent number 8,193,800
- Issue date Jun 5, 2012
- International Business Machines Corporation
- Yaping Zhou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,256,488
- Issue date Aug 14, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedane measurement of chip, package, and board power supply syste...
- Patent number 7,203,608
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Makoto Aikawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,049,694
- Issue date May 23, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device including bond wires
- Patent number 6,998,952
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 6,992,377
- Issue date Jan 31, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic noise shielding in semiconductor packages using cag...
- Patent number 6,933,599
- Issue date Aug 23, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURES TO IMPROVE SIGNAL INTEGRITY WITHIN STACK...
- Publication number 20230034619
- Publication date Feb 2, 2023
- NVIDIA Corporation
- Walker J. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTANCE AND CAPACITANCE BALANCING SYSTEMS AND METHODS
- Publication number 20190237417
- Publication date Aug 1, 2019
- NVIDIA Corporation
- Jim Dobbins
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CROSS TALK REDUCTION DIFFERENTIAL CROSS OVER ROUTING SYSTEMS AND ME...
- Publication number 20190237399
- Publication date Aug 1, 2019
- NVIDIA Corporation
- Jim Dobbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING HIGH SPEED SIGNALS
- Publication number 20150071333
- Publication date Mar 12, 2015
- NVIDIA Corporation
- Yaping Zhou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INDUCTORS FOR INTEGRATED VOLTAGE REGULATORS
- Publication number 20150054573
- Publication date Feb 26, 2015
- NVIDIA Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array with Improved Single-Ended and Differential Signal...
- Publication number 20130087918
- Publication date Apr 11, 2013
- International Business Machines Corporation
- Roger D. Weekly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus to Reduce Impedance Discontinuity in Packages
- Publication number 20130075148
- Publication date Mar 28, 2013
- IBM Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY WITH IMPROVED SINGLE-ENDED AND DIFFERENTIAL SIGNAL...
- Publication number 20130015573
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING INCLUDING AUXILIARY CIRCUITRY
- Publication number 20120175763
- Publication date Jul 12, 2012
- International Business Machines Corporation
- PAUL M. HARVEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS
- Publication number 20120138349
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array with Improved Single-Ended and Differential Signal...
- Publication number 20120001327
- Publication date Jan 5, 2012
- International Business Machines Corporation
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS
- Publication number 20110147044
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATING WORST CASE BIT PATTERNS FOR SIMULTANEOUS SWITCHING NOISE...
- Publication number 20100017158
- Publication date Jan 21, 2010
- International Business Machines Corporation
- Rohan Mandrekar
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS
- Publication number 20090302874
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Paul M. Harvey
- G01 - MEASURING TESTING
Information Patent Application
Voltage Controlled On-Chip Decoupling Capacitance to Mitigate Power...
- Publication number 20090189713
- Publication date Jul 30, 2009
- Yaping Zhou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method and Apparatus to Reduce Impedance Discontinuity in Packages
- Publication number 20090126983
- Publication date May 21, 2009
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Determining a Guard Band for an Operating Vol...
- Publication number 20080189090
- Publication date Aug 7, 2008
- Makoto Aikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20060163716
- Publication date Jul 27, 2006
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20060065966
- Publication date Mar 30, 2006
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20050189643
- Publication date Sep 1, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive device including bond wires
- Publication number 20050122198
- Publication date Jun 9, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic noise shielding in semiconductor packages using cag...
- Publication number 20050087856
- Publication date Apr 28, 2005
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS

Yaping Zhou

Person

Patents Grantslast 30 patents

Interconnection structures to improve signal integrity within stack...

Resistance and capacitance balancing systems and methods

Cross talk reduction differential cross over routing systems and me...

Inductors for integrated voltage regulators

Filtering high speed signals

Reducing impedance discontinuity in packages

Ball grid array with improved single-ended and differential signal...

Method and apparatus to reduce impedance discontinuity in packages

Ball grid array with improved single-ended and differential signal...

System to improve coreless package connections

Ball grid array with improved single-ended and differential signal...

System to improve coreless package connections

Voltage controlled on-chip decoupling capacitance to mitigate power...

Semiconductor package with crossing conductor assembly and method o...

Impedane measurement of chip, package, and board power supply syste...

Semiconductor package with crossing conductor assembly and method o...

Inductive device including bond wires

Semiconductor package with crossing conductor assembly and method o...

Electromagnetic noise shielding in semiconductor packages using cag...

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURES TO IMPROVE SIGNAL INTEGRITY WITHIN STACK...

RESISTANCE AND CAPACITANCE BALANCING SYSTEMS AND METHODS

CROSS TALK REDUCTION DIFFERENTIAL CROSS OVER ROUTING SYSTEMS AND ME...

FILTERING HIGH SPEED SIGNALS

INDUCTORS FOR INTEGRATED VOLTAGE REGULATORS

Ball Grid Array with Improved Single-Ended and Differential Signal...

Method and Apparatus to Reduce Impedance Discontinuity in Packages

BALL GRID ARRAY WITH IMPROVED SINGLE-ENDED AND DIFFERENTIAL SIGNAL...

INTEGRATED CIRCUIT PACKAGING INCLUDING AUXILIARY CIRCUITRY

SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS

Ball Grid Array with Improved Single-Ended and Differential Signal...

SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS

GENERATING WORST CASE BIT PATTERNS FOR SIMULTANEOUS SWITCHING NOISE...

METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS

Voltage Controlled On-Chip Decoupling Capacitance to Mitigate Power...

Method and Apparatus to Reduce Impedance Discontinuity in Packages

System and Method for Determining a Guard Band for an Operating Vol...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Inductive device including bond wires

Electromagnetic noise shielding in semiconductor packages using cag...