Yasuaki Nakazato

Person

Koshoku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing semiconductor substrate
- Patent number 5,395,788
- Issue date Mar 7, 1995
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- G02 - OPTICS
Information Patent Grant
SOI semiconductor substrate
- Patent number 5,266,824
- Issue date Nov 30, 1993
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- G02 - OPTICS
Information Patent Grant
Method for production of bonded wafer
- Patent number 5,232,870
- Issue date Aug 3, 1993
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling thickness of single crystal thin-film layer...
- Patent number 5,223,080
- Issue date Jun 29, 1993
- Shin-Etsu Handotai Co., Ltd.
- Yutaka Ohta
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for making uniform the thickness of a Si single crystal thin...
- Patent number 5,213,657
- Issue date May 25, 1993
- Shin-Etsu Handotai Kabushiki Kaisha
- Takao Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a substrate for forming semiconductor devices...
- Patent number 5,071,785
- Issue date Dec 10, 1991
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device substrate using polishin...
- Patent number 5,032,544
- Issue date Jul 16, 1991
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for wet treatment of wafer materials
- Patent number 4,388,140
- Issue date Jun 14, 1983
- Shin-Etsu Chemical Co., Ltd.
- Yasuaki Nakazato
- H01 - BASIC ELECTRIC ELEMENTS

Yasuaki Nakazato

Person

Patents Grantslast 30 patents

Method of producing semiconductor substrate

SOI semiconductor substrate

Method for production of bonded wafer

Method for controlling thickness of single crystal thin-film layer...

Method for making uniform the thickness of a Si single crystal thin...

Method for preparing a substrate for forming semiconductor devices...

Process for producing semiconductor device substrate using polishin...

Apparatus for wet treatment of wafer materials