Yasuaki Nakazato

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Koshoku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of cutting a workpiece with a wire saw
- Patent number 5,931,147
- Issue date Aug 3, 1999
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method of lapping works
- Patent number 5,800,251
- Issue date Sep 1, 1998
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafer
- Patent number 5,191,738
- Issue date Mar 9, 1993
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- B24 - GRINDING POLISHING