Yasuaki Seki

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and manufacturing method of the printed circu...
- Patent number 6,710,260
- Issue date Mar 23, 2004
- Victor Company of Japan, Ltd.
- Yasuaki Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating resin composition for multilayer printed-wiring board
- Patent number 6,613,987
- Issue date Sep 2, 2003
- Ajinomoto Co., Inc.
- Yasuaki Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 6,284,308
- Issue date Sep 4, 2001
- Victor Company of Japan, Ltd.
- Yasuaki Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Insulating resin composition for multilayer printed-wiring board
- Publication number 20030007332
- Publication date Jan 9, 2003
- Yasuaki Seki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing method of printed circuit board
- Publication number 20020001699
- Publication date Jan 3, 2002
- Victor Company of Japan, Ltd.
- Yasuaki Seki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20010008650
- Publication date Jul 19, 2001
- YASUAKI SEKI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC