Yasuaki Tsuchiya

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,779,992
- Issue date Oct 3, 2017
- Renesas Electronics Corporation
- Ryohei Kitao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,275,935
- Issue date Mar 1, 2016
- Renesas Electronics Corporation
- Ryohei Kitao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating process and manufacturing process for semiconductor device...
- Patent number 8,512,540
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Akira Furuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,329,584
- Issue date Dec 11, 2012
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,955,980
- Issue date Jun 7, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manfacturing semiconductor device
- Patent number 7,601,640
- Issue date Oct 13, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing
- Patent number 7,229,570
- Issue date Jun 12, 2007
- NEC Electronics Corporation
- Toshiji Taiji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming metal wiring line including using a first insulat...
- Patent number 7,091,123
- Issue date Aug 15, 2006
- NEC Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,067,427
- Issue date Jun 27, 2006
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method of chemical mech...
- Patent number 6,951,512
- Issue date Oct 4, 2005
- NEC Electronics Corporation
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Process for forming a metal interconnect
- Patent number 6,930,037
- Issue date Aug 16, 2005
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor apparatus using chemical me...
- Patent number 6,831,014
- Issue date Dec 14, 2004
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method of chemical mech...
- Patent number 6,783,446
- Issue date Aug 31, 2004
- NEC Electronics Corporation
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,723,626
- Issue date Apr 20, 2004
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing
- Patent number 6,585,786
- Issue date Jul 1, 2003
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing slurry
- Patent number 6,585,568
- Issue date Jul 1, 2003
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing slurry
- Patent number 6,530,968
- Issue date Mar 11, 2003
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry for chemical mechanical polishing
- Patent number 6,478,834
- Issue date Nov 12, 2002
- NEC Corp.
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing process for use in method of fabricating semiconductor de...
- Patent number 6,443,807
- Issue date Sep 3, 2002
- NEC Corporation
- Tetsuya Sakai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a copper-containing metal interconnect using a ch...
- Patent number 6,436,811
- Issue date Aug 20, 2002
- NEC Corporation
- Tomoko Wake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Abrasive pad and polishing method
- Patent number 6,428,405
- Issue date Aug 6, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device and chemical mechanica...
- Patent number 6,368,981
- Issue date Apr 9, 2002
- NEC Corporation
- Kazumi Sugai
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chemical mechanical polishing
- Patent number 6,350,186
- Issue date Feb 26, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method for highly accurate in-plane u...
- Patent number 6,235,071
- Issue date May 22, 2001
- NEC Corporation
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device having multilayer wiring
- Patent number 6,225,217
- Issue date May 1, 2001
- NEC Corporation
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a buried plug and an interconnection
- Patent number 6,184,120
- Issue date Feb 6, 2001
- NEC Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having multilayer wiring
- Patent number 6,140,225
- Issue date Oct 31, 2000
- NEC Corporation
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a copper wiring pattern
- Patent number 5,959,359
- Issue date Sep 28, 1999
- NEC Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230097408
- Publication date Mar 30, 2023
- RENESAS ELECTRONICS CORPORATION
- Nozomi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160148841
- Publication date May 26, 2016
- RENESAS ELECTRONICS CORPORATION
- RYOHEI KITAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140061940
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryohei KITAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110230051
- Publication date Sep 22, 2011
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING PROCESS AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE...
- Publication number 20110155578
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Akira FURUYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090305496
- Publication date Dec 10, 2009
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANFACTURING SEMICONCUDTOR DEVICE
- Publication number 20080160750
- Publication date Jul 3, 2008
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planting process and manufacturing process for semiconductor device...
- Publication number 20060237319
- Publication date Oct 26, 2006
- Akira Furuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical mechanical polishing apparatus and method of chemical mech...
- Publication number 20040259482
- Publication date Dec 23, 2004
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing slurry
- Publication number 20040216389
- Publication date Nov 4, 2004
- NEC Electronics Corporation
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20040023483
- Publication date Feb 5, 2004
- NEC ELECTRONICS CORPORATION
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for polishing copper-based metal
- Publication number 20040020135
- Publication date Feb 5, 2004
- NEC ELECTRONICS CORPORATION
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20040021125
- Publication date Feb 5, 2004
- NEC ELECTRONICS CORPORATION
- Toshiji Taiji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of forming metal wiring line
- Publication number 20030049927
- Publication date Mar 13, 2003
- NEC Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor apparatus using chemical me...
- Publication number 20030049929
- Publication date Mar 13, 2003
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20030045090
- Publication date Mar 6, 2003
- NEC Corporation
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20020104268
- Publication date Aug 8, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical mechanical polishing slurry
- Publication number 20020095872
- Publication date Jul 25, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20020095874
- Publication date Jul 25, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical mechanical polishing slurry
- Publication number 20020093002
- Publication date Jul 18, 2002
- NEC Corporation
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for forming a metal interconnect
- Publication number 20020037642
- Publication date Mar 28, 2002
- Tomoko Wake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20010018270
- Publication date Aug 30, 2001
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for forming a metal interconnect
- Publication number 20010006841
- Publication date Jul 5, 2001
- Yasuaki Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20010006225
- Publication date Jul 5, 2001
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20010006224
- Publication date Jul 5, 2001
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20010006031
- Publication date Jul 5, 2001
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing
- Publication number 20010005009
- Publication date Jun 28, 2001
- Yasuaki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yasuaki Tsuchiya

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Plating process and manufacturing process for semiconductor device...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manfacturing semiconductor device

Slurry for chemical mechanical polishing

Method of forming metal wiring line including using a first insulat...

Manufacturing method of semiconductor device

Chemical mechanical polishing apparatus and method of chemical mech...

Process for forming a metal interconnect

Method of manufacturing a semiconductor apparatus using chemical me...

Chemical mechanical polishing apparatus and method of chemical mech...

Method of manufacturing semiconductor device

Slurry for chemical mechanical polishing

Chemical mechanical polishing slurry

Chemical mechanical polishing slurry

Slurry for chemical mechanical polishing

Polishing process for use in method of fabricating semiconductor de...

Method of forming a copper-containing metal interconnect using a ch...

Abrasive pad and polishing method

Method of manufacturing semiconductor device and chemical mechanica...

Apparatus and method for chemical mechanical polishing

Chemical mechanical polishing method for highly accurate in-plane u...

Method of manufacturing semiconductor device having multilayer wiring

Method of forming a buried plug and an interconnection

Method of manufacturing semiconductor device having multilayer wiring

Semiconductor device with a copper wiring pattern

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PLATING PROCESS AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANFACTURING SEMICONCUDTOR DEVICE

Planting process and manufacturing process for semiconductor device...

Chemical mechanical polishing apparatus and method of chemical mech...

Chemical mechanical polishing slurry

Manufacturing method of semiconductor device

Slurry for polishing copper-based metal

Slurry for chemical mechanical polishing

Method of forming metal wiring line

Method of manufacturing a semiconductor apparatus using chemical me...

Method of manufacturing semiconductor device

Slurry for chemical mechanical polishing

Chemical mechanical polishing slurry

Slurry for chemical mechanical polishing

Chemical mechanical polishing slurry

Process for forming a metal interconnect

Slurry for chemical mechanical polishing

Process for forming a metal interconnect

Slurry for chemical mechanical polishing

Slurry for chemical mechanical polishing

Slurry for chemical mechanical polishing

Slurry for chemical mechanical polishing