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Yasuhide Ohno
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Method of producing fine metal spheres of uniform size
Patent number
5,761,779
Issue date
Jun 9, 1998
Nippon Steel Corporation
Tadakatsu Maruyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin gold-alloy wire for semiconductor device
Patent number
5,658,664
Issue date
Aug 19, 1997
Nippon Steel Corporation
Tomohiro Uno
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Bonding wire for semiconductor element
Patent number
5,491,034
Issue date
Feb 13, 1996
Nippon Steel Corporation
Yasuhide Ohno
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Composite lead frame and semiconductor device using the same
Patent number
5,227,662
Issue date
Jul 13, 1993
Nippon Steel Corporation
Yasuhide Ohno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of connecting TAB tape to semiconductor chip, and bump sheet...
Patent number
5,164,336
Issue date
Nov 17, 1992
Nippon Steel Corporation
Yasuhide Ohno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding bumps to leads of tab tape and an apparatus for a...
Patent number
5,114,878
Issue date
May 19, 1992
Nippon Steel Corporation
Tadakatsu Maruyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of cracking of continuously cast steel slabs containing...
Patent number
4,379,482
Issue date
Apr 12, 1983
Nippon Steel Corporation
Hiroo Suzuki
B22 - CASTING POWDER METALLURGY