Yasuhide Ohno

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method and bonding apparatus
- Patent number 8,318,585
- Issue date Nov 27, 2012
- Shinko Seiki Company, Limited
- Yasuhide Ohno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD AND BONDING APPARATUS
- Publication number 20110045653
- Publication date Feb 24, 2011
- SHINKO SEIKI COMPANY, LIMITED
- Yasuhide Ohno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method
- Publication number 20070170227
- Publication date Jul 26, 2007
- Yasuhide Ohno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR