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Yasuhiko Sakaki

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  • Hiratsuka-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 7,108,776
    • Issue date Sep 19, 2006
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup type plating apparatus
    • Patent number 6,991,711
    • Issue date Jan 31, 2006
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating apparatus for wafer
    • Patent number 6,875,333
    • Issue date Apr 5, 2005
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup-type plating apparatus and method for plating wafers
    • Patent number 6,610,182
    • Issue date Aug 26, 2003
    • Electroplating Engineers of Japan, Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup shaped plating apparatus with a disc shaped stirring device hav...
    • Patent number 6,482,300
    • Issue date Nov 19, 2002
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cup type plating apparatus
    • Patent number 6,454,918
    • Issue date Sep 24, 2002
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup-type plating apparatus and method for plating wafer using the same
    • Patent number 6,332,963
    • Issue date Dec 25, 2001
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Plating apparatus for wafer
    • Publication number 20030153185
    • Publication date Aug 14, 2003
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20030070932
    • Publication date Apr 17, 2003
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cup-type plating apparatus
    • Publication number 20020108850
    • Publication date Aug 15, 2002
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cup type plating apparatus
    • Publication number 20020088708
    • Publication date Jul 11, 2002
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cup - type plating apparatus
    • Publication number 20020066665
    • Publication date Jun 6, 2002
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR