Yasuhiro Morimoto

Follow

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for forming bumps for semiconductor interconne...
- Patent number 7,651,022
- Issue date Jan 26, 2010
- Kulicke and Soffa Industries, Inc.
- Stephen Babinetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming bumps for semiconductor interconne...
- Patent number 7,229,906
- Issue date Jun 12, 2007
- Kulicke and Soffa Industries, Inc.
- Stephen Babinetz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR FORMING BUMPS FOR SEMICONDUCTOR INTERCONNE...
- Publication number 20070199974
- Publication date Aug 30, 2007
- KULICKE AND SOFFA INDUSTRIES, INC.
- Stephen Babinetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for forming bumps for semiconductor interconne...
- Publication number 20040152292
- Publication date Aug 5, 2004
- Stephen Babinetz
- H01 - BASIC ELECTRIC ELEMENTS