Yasuhiro Shinma

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device used in a stacked-type...
- Patent number 9,368,424
- Issue date Jun 14, 2016
- Cypress Semiconductor Corporation
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,293,441
- Issue date Mar 22, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 9,142,440
- Issue date Sep 22, 2015
- Cypess Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and a method for fabricating the same
- Patent number 8,174,107
- Issue date May 8, 2012
- Spansion LLC
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,179
- Issue date Oct 4, 2011
- Spansion, LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,851,260
- Issue date Dec 14, 2010
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,846,771
- Issue date Dec 7, 2010
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type semiconductor device and method of fabricating stacked...
- Patent number 7,696,616
- Issue date Apr 13, 2010
- Spansion LLC
- Yasuhiro Shinma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,642,637
- Issue date Jan 5, 2010
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor device
- Patent number 7,622,067
- Issue date Nov 24, 2009
- Spansion LLC
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,605,457
- Issue date Oct 20, 2009
- Spansion LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 7,489,029
- Issue date Feb 10, 2009
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,414,305
- Issue date Aug 19, 2008
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,285,848
- Issue date Oct 23, 2007
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and mold for manufacturing semiconductor device, semiconduct...
- Patent number 6,881,611
- Issue date Apr 19, 2005
- Fujitsu Limited
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Split-mold and method for manufacturing semiconductor device by usi...
- Patent number 6,563,207
- Issue date May 13, 2003
- Fujitsu Limited
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor device and method of manufacturing the same
- Patent number 6,515,347
- Issue date Feb 4, 2003
- Fujitsu Limited
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor devices having easy separability...
- Patent number 6,511,620
- Issue date Jan 28, 2003
- Fujitsu Limited
- Toshimi Kawahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold for fabricating semiconductor devices
- Patent number 6,471,501
- Issue date Oct 29, 2002
- Fujitsu Limited
- Yasuhiro Shinma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method of production of the semiconductor...
- Patent number 6,469,370
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split-mold and method for manufacturing semiconductor device by usi...
- Patent number 6,444,500
- Issue date Sep 3, 2002
- Fujitsu Limited
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device, base member for semico...
- Patent number 6,022,759
- Issue date Feb 8, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, base member for semiconductor device and semi...
- Patent number 5,747,874
- Issue date May 5, 1998
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120025364
- Publication date Feb 2, 2012
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090325346
- Publication date Dec 31, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES AND A METHOD FOR FABRICATING THE SAME
- Publication number 20090315166
- Publication date Dec 24, 2009
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20090311831
- Publication date Dec 17, 2009
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Structure for stacked-type semiconductor device, method of...
- Publication number 20090093085
- Publication date Apr 9, 2009
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICA...
- Publication number 20080274591
- Publication date Nov 6, 2008
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20070290320
- Publication date Dec 20, 2007
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070145579
- Publication date Jun 28, 2007
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing a semiconductor device
- Publication number 20060279021
- Publication date Dec 14, 2006
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20060245908
- Publication date Nov 2, 2006
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked type semiconductor device and method of fabricating stacked...
- Publication number 20060170090
- Publication date Aug 3, 2006
- Spansion LLC
- Yasuhiro Shinma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier structure for stacked-type semiconductor device, method of...
- Publication number 20060043600
- Publication date Mar 2, 2006
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20050269682
- Publication date Dec 8, 2005
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor device and semiconductor device
- Publication number 20050263871
- Publication date Dec 1, 2005
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split-mold and method for manufacturing semiconductor device by usi...
- Publication number 20020164391
- Publication date Nov 7, 2002
- Fujitsu Limited of Kawasaki
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and mold for manufacturing semiconductor device, semiconduct...
- Publication number 20020030258
- Publication date Mar 14, 2002
- FUJITSU LIMITED
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...
- Publication number 20010003049
- Publication date Jun 7, 2001
- NORIO FUKASAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Yasuhiro Shinma

Person

Patents Grantslast 30 patents

Method of fabricating a semiconductor device used in a stacked-type...

Semiconductor device and method of manufacturing the same

Carrier structure for stacked-type semiconductor device, method of...

Stacked semiconductor devices and a method for fabricating the same

Semiconductor device and method of manufacturing the same

Method for manufacturing a semiconductor device

Carrier for stacked type semiconductor device and method of fabrica...

Stacked type semiconductor device and method of fabricating stacked...

Carrier for stacked type semiconductor device and method of fabrica...

Apparatus and method for manufacturing a semiconductor device

Semiconductor device and method of manufacturing the same

Carrier structure for stacked-type semiconductor device, method of...

Carrier for stacked type semiconductor device and method of fabrica...

Carrier for stacked type semiconductor device and method of fabrica...

Method and mold for manufacturing semiconductor device, semiconduct...

Split-mold and method for manufacturing semiconductor device by usi...

Wafer level semiconductor device and method of manufacturing the same

Method of producing semiconductor devices having easy separability...

Mold for fabricating semiconductor devices

Semiconductor device and method of production of the semiconductor...

Split-mold and method for manufacturing semiconductor device by usi...

Method for producing a semiconductor device, base member for semico...

Semiconductor device, base member for semiconductor device and semi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DEVICES AND A METHOD FOR FABRICATING THE SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Carrier Structure for stacked-type semiconductor device, method of...

CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICA...

Carrier for stacked type semiconductor device and method of fabrica...

Semiconductor device and method of manufacturing the same

Apparatus and method for manufacturing a semiconductor device

Carrier for stacked type semiconductor device and method of fabrica...

Stacked type semiconductor device and method of fabricating stacked...

Carrier structure for stacked-type semiconductor device, method of...

Carrier for stacked type semiconductor device and method of fabrica...

Method of fabricating semiconductor device and semiconductor device

Split-mold and method for manufacturing semiconductor device by usi...

Method and mold for manufacturing semiconductor device, semiconduct...

METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...