YASUHIRO SUGAYA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, package, and vehicle
- Patent number 10,186,479
- Issue date Jan 22, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidenori Katsumura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device, embedded capacitor unit, semiconductor packag...
- Patent number 9,905,501
- Issue date Feb 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component incorporating interposer
- Patent number 7,968,800
- Issue date Jun 28, 2011
- Panasonic Corporation
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer material used for producing a wiring substrate
- Patent number 7,888,789
- Issue date Feb 15, 2011
- Panasonic Corporation
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 7,821,795
- Issue date Oct 26, 2010
- Panasonic Corporation
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board, mounted body, and electronic equipment using the same
- Patent number 7,667,977
- Issue date Feb 23, 2010
- Panasonic Corporation
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in module and method of manufacturing th...
- Patent number 7,394,663
- Issue date Jul 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,390,692
- Issue date Jun 24, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,341,890
- Issue date Mar 11, 2008
- Matsushita Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 7,294,587
- Issue date Nov 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing surface acoustic wave device
- Patent number 7,246,421
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Akihiko Namba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with built-in circuit component and method for producing the...
- Patent number 7,248,482
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transmission channel board, board with built-in optical tra...
- Patent number 7,242,823
- Issue date Jul 10, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 7,198,996
- Issue date Apr 3, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite electronic component
- Patent number 7,187,071
- Issue date Mar 6, 2007
- Matsushita Electric Industrial Co., Ltd.
- Michiaki Tsuneoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module and method for manufacturing the...
- Patent number 7,180,169
- Issue date Feb 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with a built-in semiconductor and method for producing the same
- Patent number 7,141,884
- Issue date Nov 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount assembly, optical transmission line and photoelectric circuit...
- Patent number 7,136,543
- Issue date Nov 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Tousaku Nishiyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing electric element built-in module with seal...
- Patent number 7,134,198
- Issue date Nov 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,132,756
- Issue date Nov 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,091,593
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor built-in millimeter-wave band module
- Patent number 7,061,100
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hideki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component built-in module with embedded semiconductor chip...
- Patent number 7,018,866
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a capacitor-embedded circuit board
- Patent number 7,013,561
- Issue date Mar 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer sheet and wiring board using the same, and method of manuf...
- Patent number 7,001,662
- Issue date Feb 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 6,975,516
- Issue date Dec 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave device, method for manufacturing, and electro...
- Patent number 6,969,945
- Issue date Nov 29, 2005
- Matsushita Electric Industrial Co., Ltd.
- Akihiko Namba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filter, antenna duplexer
- Patent number 6,965,284
- Issue date Nov 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tomoya Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component built-in module
- Patent number 6,955,948
- Issue date Oct 18, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 6,939,738
- Issue date Sep 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LITHIUM ION SECONDARY BATTERY AND METHOD FOR PRODUCING THE SAME
- Publication number 20190181495
- Publication date Jun 13, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Yuji Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE, AND VEHICLE
- Publication number 20170162490
- Publication date Jun 8, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- HIDENORI KATSUMURA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, EMBEDDED CAPACITOR UNIT, SEMICONDUCTOR PACKAG...
- Publication number 20170077019
- Publication date Mar 16, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YASUHIRO SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140008104
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENT INCORPORATING INTERPOSER
- Publication number 20100155119
- Publication date Jun 24, 2010
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mounting Board, Mounted Body, and Electronic Equipment Using the Same
- Publication number 20080290497
- Publication date Nov 27, 2008
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Board, Method for Manufacturing Such Multilayer W...
- Publication number 20070242440
- Publication date Oct 18, 2007
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSMISSION CHANNEL BOARD, BOARD WITH BUILT-IN OPTICAL TRA...
- Publication number 20070224735
- Publication date Sep 27, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- G02 - OPTICS
Information Patent Application
Wiring board embedded with spherical semiconductor element
- Publication number 20070069393
- Publication date Mar 29, 2007
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20060290009
- Publication date Dec 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with built-in electronic component and method for man...
- Publication number 20060244119
- Publication date Nov 2, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite electronic component
- Publication number 20060244123
- Publication date Nov 2, 2006
- Michiaki Tsuneoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer sheet and wiring board using the same, and method of manuf...
- Publication number 20060078669
- Publication date Apr 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface acoustic wave device, its manufacturing method, and electro...
- Publication number 20060006760
- Publication date Jan 12, 2006
- Akihiko Namba
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20050269681
- Publication date Dec 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Dielectric resonator, dielectric filter and method of producing the...
- Publication number 20050236103
- Publication date Oct 27, 2005
- Yasuhiro Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20050230848
- Publication date Oct 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method for optical transmission channel board, optical...
- Publication number 20050196095
- Publication date Sep 8, 2005
- Seiji Karashima
- G02 - OPTICS
Information Patent Application
Wiring substrate produced by transfer material method
- Publication number 20050186768
- Publication date Aug 25, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module and method for manufacturing the...
- Publication number 20050045369
- Publication date Mar 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with in-built electronic component and method for man...
- Publication number 20050006142
- Publication date Jan 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with a built-in semiconductor and method for producing the same
- Publication number 20050001331
- Publication date Jan 6, 2005
- Toshiyuki Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mount assembly, optical transmission line and photoelectric circuit...
- Publication number 20050002608
- Publication date Jan 6, 2005
- Tousaku Nishiyama
- G02 - OPTICS
Information Patent Application
Module with built-in circuit component and method for producing the...
- Publication number 20040226744
- Publication date Nov 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing a wiring board and electroni...
- Publication number 20040194999
- Publication date Oct 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer sheet and wiring board using the same, and method of manuf...
- Publication number 20040191491
- Publication date Sep 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component built-in module and method of manufacturing th...
- Publication number 20040160752
- Publication date Aug 19, 2004
- Matsushita Electric Industrial Co.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20040158980
- Publication date Aug 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module with embedded semiconductor chip...
- Publication number 20040145044
- Publication date Jul 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040084769
- Publication date May 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

YASUHIRO SUGAYA

Person

Patents Grantslast 30 patents

Semiconductor device, package, and vehicle

Semiconductor device, embedded capacitor unit, semiconductor packag...

Passive component incorporating interposer

Transfer material used for producing a wiring substrate

Multilayer wiring board

Mounting board, mounted body, and electronic equipment using the same

Electronic component built-in module and method of manufacturing th...

Semiconductor device and method for manufacturing the same

Circuit board with built-in electronic component and method for man...

Component built-in module and method for producing the same

Method for manufacturing surface acoustic wave device

Module with built-in circuit component and method for producing the...

Optical transmission channel board, board with built-in optical tra...

Component built-in module and method for producing the same

Composite electronic component

Circuit component built-in module and method for manufacturing the...

Module with a built-in semiconductor and method for producing the same

Mount assembly, optical transmission line and photoelectric circuit...

Method for manufacturing electric element built-in module with seal...

Semiconductor device and method for manufacturing the same

Circuit board with built-in electronic component and method for man...

Semiconductor built-in millimeter-wave band module

Circuit component built-in module with embedded semiconductor chip...

Method for producing a capacitor-embedded circuit board

Transfer sheet and wiring board using the same, and method of manuf...

Component built-in module and method for producing the same

Surface acoustic wave device, method for manufacturing, and electro...

Dielectric filter, antenna duplexer

Method of manufacturing a component built-in module

Component built-in module and method for producing the same

Patents Applicationslast 30 patents

LITHIUM ION SECONDARY BATTERY AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, PACKAGE, AND VEHICLE

SEMICONDUCTOR DEVICE, EMBEDDED CAPACITOR UNIT, SEMICONDUCTOR PACKAG...

RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PASSIVE COMPONENT INCORPORATING INTERPOSER

Mounting Board, Mounted Body, and Electronic Equipment Using the Same

Multilayer Wiring Board, Method for Manufacturing Such Multilayer W...

OPTICAL TRANSMISSION CHANNEL BOARD, BOARD WITH BUILT-IN OPTICAL TRA...

Wiring board embedded with spherical semiconductor element

Semiconductor device and method for manufacturing the same

Circuit board with built-in electronic component and method for man...

Composite electronic component

Transfer sheet and wiring board using the same, and method of manuf...

Surface acoustic wave device, its manufacturing method, and electro...

Component built-in module and method for producing the same

Dielectric resonator, dielectric filter and method of producing the...

Component built-in module and method for producing the same

Fabrication method for optical transmission channel board, optical...

Wiring substrate produced by transfer material method

Circuit component built-in module and method for manufacturing the...

Circuit board with in-built electronic component and method for man...

Module with a built-in semiconductor and method for producing the same

Mount assembly, optical transmission line and photoelectric circuit...

Module with built-in circuit component and method for producing the...

Wiring board, method for manufacturing a wiring board and electroni...

Transfer sheet and wiring board using the same, and method of manuf...

Electronic component built-in module and method of manufacturing th...

Component built-in module and method for producing the same

Circuit component built-in module with embedded semiconductor chip...

Semiconductor device and method for manufacturing the same