Yasuhiro Takahashi

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,763,319
- Issue date Sep 12, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,443,800
- Issue date Sep 13, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 9,287,250
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 9,263,784
- Issue date Feb 16, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20150357316
- Publication date Dec 10, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20150327363
- Publication date Nov 12, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20150318596
- Publication date Nov 5, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20150279772
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20140374150
- Publication date Dec 25, 2014
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS