Yasuhiro TAKASE

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat curable resin composition, and circuit board with electronic c...
- Patent number 10,870,725
- Issue date Dec 22, 2020
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounting method utilizing active resin composition
- Patent number 9,072,205
- Issue date Jun 30, 2015
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting using cleaning-free activated resinous...
- Patent number 8,551,819
- Issue date Oct 8, 2013
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
HEAT CURABLE RESIN COMPOSITION, AND CIRCUIT BOARD WITH ELECTRONIC C...
- Publication number 20170335049
- Publication date Nov 23, 2017
- SAN-EI KAGAKU CO., LTD.
- Yasuhiro TAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION
- Publication number 20150158103
- Publication date Jun 11, 2015
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION...
- Publication number 20150027768
- Publication date Jan 29, 2015
- SAN-EI KAGAKU CO., LTD.
- Yasuhiro TAKASE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRIN...
- Publication number 20120168219
- Publication date Jul 5, 2012
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS...
- Publication number 20120153009
- Publication date Jun 21, 2012
- SAN-EI KAGAKU CO., LTD.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE...
- Publication number 20110031300
- Publication date Feb 10, 2011
- SAN-EI KAGAKU CO., LTD.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yasuhiro TAKASE

Person

Patents Grantslast 30 patents

Heat curable resin composition, and circuit board with electronic c...

Resin composition for solder bump formation, solder bump formation...

Surface mounting method utilizing active resin composition

Method for surface mounting using cleaning-free activated resinous...

Patents Applicationslast 30 patents

HEAT CURABLE RESIN COMPOSITION, AND CIRCUIT BOARD WITH ELECTRONIC C...

SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION

RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION...

ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRIN...

METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS...

CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE...