Yasuhiro Teraoka

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Itami, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,166,099
- Issue date Nov 24, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding packaged semiconductor device incorporating...
- Patent number 5,157,478
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape including molten resin flow path element for resin pac...
- Patent number 5,064,706
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device
- Patent number 4,839,713
- Issue date Jun 13, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Teraoka
- H01 - BASIC ELECTRIC ELEMENTS