Yasuhiro Teshima

Person

Oyama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit component and mounting method thereof
- Patent number 7,375,429
- Issue date May 20, 2008
- Fujitsu Limited
- Yasuhiro Teshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SFP module mounting structure
- Patent number 7,044,763
- Issue date May 16, 2006
- Fujitsu Limited
- Takashi Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BWB transmission wiring design system
- Patent number 6,883,157
- Issue date Apr 19, 2005
- Fujitsu Limited
- Hideaki Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of surface mounting a connector and connector
- Patent number 6,655,990
- Issue date Dec 2, 2003
- Fujitsu Limited
- Hideaki Terauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit pin connection checking method and system
- Patent number 6,444,925
- Issue date Sep 3, 2002
- Fujitsu Limited
- Yasuhiro Teshima
- G01 - MEASURING TESTING
Information Patent Grant
Method of surface mounting a connector
- Patent number 6,081,998
- Issue date Jul 4, 2000
- Fujitsu Limited
- Hideaki Terauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 6,038,135
- Issue date Mar 14, 2000
- Fujitsu Limited
- Yutaka Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump which is inspected from outside...
- Patent number 5,828,128
- Issue date Oct 27, 1998
- Fujitsu, Ltd.
- Yutaka Higashiguchi
- G01 - MEASURING TESTING
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 5,783,865
- Issue date Jul 21, 1998
- Fujitsu Limited
- Yutaka Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device mounting board
- Patent number 5,760,469
- Issue date Jun 2, 1998
- Fujitsu Limited
- Yutaka Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask for printing solder paste
- Patent number 5,593,080
- Issue date Jan 14, 1997
- Fujitsu Limited
- Yasuhiro Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating furnace in combination with electronic circuit modules
- Patent number 5,413,164
- Issue date May 9, 1995
- Fujitsu Limited
- Yasuhiro Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit component and mounting method thereof
- Publication number 20060108607
- Publication date May 25, 2006
- Yasuhiro Teshima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BWB transmission wiring design system
- Publication number 20030217349
- Publication date Nov 20, 2003
- Hideaki Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRESS-FIT PIN CONNECTION CHECKING METHOD AND SYSTEM
- Publication number 20020104683
- Publication date Aug 8, 2002
- Yasuhiro Teshima
- G01 - MEASURING TESTING
Information Patent Application
Method of surface mounting a connector and connector
- Publication number 20020076979
- Publication date Jun 20, 2002
- Hideaki Terauchi
- H01 - BASIC ELECTRIC ELEMENTS

Yasuhiro Teshima

Person

Patents Grantslast 30 patents

Integrated circuit component and mounting method thereof

SFP module mounting structure

BWB transmission wiring design system

Method of surface mounting a connector and connector

Press-fit pin connection checking method and system

Method of surface mounting a connector

Wiring board and semiconductor device

Semiconductor device having a bump which is inspected from outside...

Wiring substrate and semiconductor device

Semiconductor device and semiconductor device mounting board

Mask for printing solder paste

Heating furnace in combination with electronic circuit modules

Patents Applicationslast 30 patents

Integrated circuit component and mounting method thereof

BWB transmission wiring design system

PRESS-FIT PIN CONNECTION CHECKING METHOD AND SYSTEM

Method of surface mounting a connector and connector