Yasuhiro Usui

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Analysis method and analysis apparatus
- Patent number 10,408,756
- Issue date Sep 10, 2019
- Fujitsu Limited
- Michiko Noguchi
- G01 - MEASURING TESTING
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,291,901
- Issue date Nov 6, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,268,002
- Issue date Sep 11, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor device with adhesive sealing subje...
- Patent number 6,869,822
- Issue date Mar 22, 2005
- Fujitsu Limited
- Tomohisa Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps using dummy wafer
- Patent number 6,057,168
- Issue date May 2, 2000
- Fujitsu Limited
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANALYSIS METHOD AND ANALYSIS APPARATUS
- Publication number 20170138850
- Publication date May 18, 2017
- Fujitsu Limited
- Michiko NOGUCHI
- G01 - MEASURING TESTING
Information Patent Application
Fluorescent X-ray analyzer, fluorescent X-ray analysis method, and...
- Publication number 20060215810
- Publication date Sep 28, 2006
- FUJITSU LIMITED
- Yasuhiro Usui
- G01 - MEASURING TESTING
Information Patent Application
Packaging method, packaging structure and package substrate for ele...
- Publication number 20060063303
- Publication date Mar 23, 2006
- FUJITSU LIMITED
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of making the same
- Publication number 20050110169
- Publication date May 26, 2005
- FUJITSU LIMITED
- Tomohisa Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging method, packaging structure and package substrate for ele...
- Publication number 20040183193
- Publication date Sep 23, 2004
- FUJITSU LIMITED
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of making the same
- Publication number 20030049888
- Publication date Mar 13, 2003
- FUJITSU LIMITED
- Tomohisa Yagi
- H01 - BASIC ELECTRIC ELEMENTS