Yasuhiro Watanabe

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Gifu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board and manufacturing method of multila...
- Patent number 8,737,087
- Issue date May 27, 2014
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 8,353,103
- Issue date Jan 15, 2013
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method of the mul...
- Patent number 7,626,829
- Issue date Dec 1, 2009
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...
- Publication number 20130112469
- Publication date May 9, 2013
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE MUL...
- Publication number 20100000087
- Publication date Jan 7, 2010
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and manufacturing method of the mul...
- Publication number 20060102384
- Publication date May 18, 2006
- IBIDEN CO., LTD.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR