Yasuhiro Yamaji

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Patents Grantslast 30 patents

Information Patent Grant
Electroless gold plating solution for forming fine gold structure,...
- Patent number 9,345,145
- Issue date May 17, 2016
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrode connection structure of semiconductor chip, conductive me...
- Patent number 8,399,979
- Issue date Mar 19, 2013
- National Institute of Advanced Industrial Science and Technology
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure of semiconductor chip, conductive me...
- Patent number 8,367,468
- Issue date Feb 5, 2013
- National Institute of Advanced Industrial Science and Technology
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...
- Publication number 20120119352
- Publication date May 17, 2012
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRODE CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP, CONDUCTIVE ME...
- Publication number 20120108008
- Publication date May 3, 2012
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode connection structure of semiconductor chip, conductive me...
- Publication number 20100044870
- Publication date Feb 25, 2010
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS