Yasuhiro Yamamoto

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Hadano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and a method for removing solder from an object
- Patent number 6,435,401
- Issue date Aug 20, 2002
- Hitachi, Ltd.
- Takeshi Miitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR