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Yasuhito Funada
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Ibaraki-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wired circuit board
Patent number
8,134,080
Issue date
Mar 13, 2012
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board having a semiconductive grounding layer and pro...
Patent number
8,071,886
Issue date
Dec 6, 2011
Nitto Denko Corporation
Jun Ishii
G11 - INFORMATION STORAGE
Information
Patent Grant
Wired circuit board
Patent number
7,638,873
Issue date
Dec 29, 2009
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board
Patent number
7,586,046
Issue date
Sep 8, 2009
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board and production method thereof
Patent number
7,566,833
Issue date
Jul 28, 2009
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Suspension board with circuit
Patent number
7,531,753
Issue date
May 12, 2009
Nitto Denko Corporation
Yasuhito Funada
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Information
Patent Grant
Suspension board with circuit
Patent number
7,525,764
Issue date
Apr 28, 2009
Nitto Denko Corporation
Tetsuya Ohsawa
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Information
Patent Grant
Wired circuit board and producing method thereof
Patent number
7,501,581
Issue date
Mar 10, 2009
Nitto Denko Corporation
Yasuhito Funada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board
Patent number
7,471,519
Issue date
Dec 30, 2008
Nitto Denko Corporation
Yasunari Ooyabu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Suspension board having a circuit and a flying lead portion
Patent number
7,336,446
Issue date
Feb 26, 2008
Nitto Denko Corporation
Hitoki Kanagawa
G11 - INFORMATION STORAGE
Information
Patent Grant
Wired circuit board assembly
Patent number
7,307,853
Issue date
Dec 11, 2007
Nitto Denko Corporation
Yasuhito Funada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board
Patent number
7,182,606
Issue date
Feb 27, 2007
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring circuit board and production method thereof
Patent number
7,084,493
Issue date
Aug 1, 2006
Nitto Denko Corporation
Yasuhito Funada
G11 - INFORMATION STORAGE
Information
Patent Grant
Photosensitive resin composition and use of the same
Patent number
7,008,752
Issue date
Mar 7, 2006
Nitto Denko Corporation
Hirofumi Fujii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Circuit-forming substrate and circuit substrate
Patent number
6,333,139
Issue date
Dec 25, 2001
Nitto Denko Corporation
Toshihiko Omote
B32 - LAYERED PRODUCTS
Information
Patent Grant
Circuit substrate, circuit-formed suspension substrate, and product...
Patent number
6,245,432
Issue date
Jun 12, 2001
Nitro Denko Corporation
Yasuhito Funada
B32 - LAYERED PRODUCTS
Information
Patent Grant
Circuit-forming substrate and circuit substrate
Patent number
6,117,616
Issue date
Sep 12, 2000
Nitto Denko Corporation
Toshihiko Omote
B32 - LAYERED PRODUCTS
Information
Patent Grant
Circuit substrate, circuit-formed suspension substrate, and product...
Patent number
6,100,582
Issue date
Aug 8, 2000
Nitto Denko Corporation
Toshihiko Omote
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Circuit substrate, circuit-formed suspension substrate, and product...
Patent number
6,096,482
Issue date
Aug 1, 2000
Nitto Denko Corporation
Toshihiko Omote
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Circuit substrate, circuit-formed suspension substrate, and product...
Patent number
5,858,518
Issue date
Jan 12, 1999
Nitto Denko Corporation
Toshihiko Omote
B32 - LAYERED PRODUCTS
Information
Patent Grant
Process for producing electrically conductive organic polymer compo...
Patent number
5,578,249
Issue date
Nov 26, 1996
Nitto Denko Corporation
Akira Ohtani
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
Wired circuit board and producing method thereof
Publication number
20090142478
Publication date
Jun 4, 2009
Nitto Denko Corporation
Yasuhito Funada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board and producing method thereof
Publication number
20080149361
Publication date
Jun 26, 2008
Nitto Denko Corporation
Jun ISHII
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Information
Patent Application
Wired circuit board and producing method thereof
Publication number
20070131449
Publication date
Jun 14, 2007
Nitto Denko Corporation
Yasuhito Funada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board
Publication number
20070128417
Publication date
Jun 7, 2007
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board
Publication number
20070051534
Publication date
Mar 8, 2007
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board
Publication number
20070017695
Publication date
Jan 25, 2007
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board and production method thereof
Publication number
20060269730
Publication date
Nov 30, 2006
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board
Publication number
20060199402
Publication date
Sep 7, 2006
Nitto Denko Corporation
Jun Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wired circuit board assembly
Publication number
20060169486
Publication date
Aug 3, 2006
Nitto Denko Corporation
Yasuhito Funada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Suspension board with circuit
Publication number
20060087769
Publication date
Apr 27, 2006
Nitto Denko Corporation
Tetsuya Ohsawa
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Wired circuit board
Publication number
20060023435
Publication date
Feb 2, 2006
Nitto Denko Corporation
Yasunari Ooyabu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Suspension board with circuit
Publication number
20050248885
Publication date
Nov 10, 2005
Nitto Denko Corporation
Yasuhito Funada
G11 - INFORMATION STORAGE
Information
Patent Application
Photosensitive resin composition and use of the same
Publication number
20050208421
Publication date
Sep 22, 2005
NITTO DENKO CORPORATION
Hirofumi Fujii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Production method of suspension board with circuit
Publication number
20050186332
Publication date
Aug 25, 2005
Nitto Denko Corporation
Yasuhito Funada
G11 - INFORMATION STORAGE
Information
Patent Application
Wiring circuit board and production method thereof
Publication number
20050161775
Publication date
Jul 28, 2005
Nitto Denko Corporation
Yasuhito Funada
G11 - INFORMATION STORAGE
Information
Patent Application
Suspension board with circuit
Publication number
20050122627
Publication date
Jun 9, 2005
Hitoki Kanagawa
G11 - INFORMATION STORAGE