Yasuhito Iguchi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer inspection method
- Patent number 10,481,177
- Issue date Nov 19, 2019
- Tokyo Seimitsu Co. Ltd.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Grant
Probing device for electronic device and probing method
- Patent number 9,983,256
- Issue date May 29, 2018
- Tokyo Seimitsu Co. Ltd.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe device for testing electrical characteristics of semiconducto...
- Patent number 9,664,733
- Issue date May 30, 2017
- Tokyo Seimitsu Co., Ltd.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Grant
Alignment support device and alignment support method for probe device
- Patent number 9,442,156
- Issue date Sep 13, 2016
- Tokyo Seimitsu Co., Ltd.
- Yuichi Ozawa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER TEST SYSTEM, PROBE CARD REPLACING METHOD, AND PROBER
- Publication number 20240369623
- Publication date Nov 7, 2024
- TOKYO SEIMITSU CO., LTD.
- Akira YAMAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION METHOD
- Publication number 20170322236
- Publication date Nov 9, 2017
- TOKYO SEIMITSU CO., LTD.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Application
Probe Device
- Publication number 20150362552
- Publication date Dec 17, 2015
- TOKYO SEIMITSU CO., LTD.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Application
Alignment Support Device and Alignment Support Method for Probe Device
- Publication number 20150362553
- Publication date Dec 17, 2015
- TOKYO SEIMITSU CO., LTD.
- Yuichi Ozawa
- G01 - MEASURING TESTING
Information Patent Application
PROBING DEVICE FOR ELECTRONIC DEVICE AND PROBING METHOD
- Publication number 20150109625
- Publication date Apr 23, 2015
- TOKYO SEIMITSU CO., LTD.
- Yuichi Ozawa
- G01 - MEASURING TESTING