Yasuhito Iwatsuki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Polishing pad for CMP, method for polishing substrate using it and...
- Patent number 7,374,474
- Issue date May 20, 2008
- Hitachi Chemical Co., Ltd.
- Masaya Nishiyama
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Polishing pad for cmp, method for polishing substrate using it and...
- Publication number 20040224623
- Publication date Nov 11, 2004
- Masaya Nishiyama
- B24 - GRINDING POLISHING