Yasuhito Suzuki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 6,600,218
- Issue date Jul 29, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designing method of leadframe tip arrangement
- Patent number 6,159,766
- Issue date Dec 12, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hirokazu Taki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe tip arrangement designing method
- Patent number 6,134,700
- Issue date Oct 17, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Akihiro Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe tip arrangement designing method
- Patent number 5,902,119
- Issue date May 11, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Hirokazu Taki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 5,424,577
- Issue date Jun 13, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhito Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20040262723
- Publication date Dec 30, 2004
- RENESAS TECHNOLOGY CORP.
- Zhikang Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030052394
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20020100963
- Publication date Aug 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhito Suzuki
- H01 - BASIC ELECTRIC ELEMENTS