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Yasuhito Takahashi
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package substrate unit and method for manufacturing package substra...
Patent number
8,800,142
Issue date
Aug 12, 2014
Fujitsu Limited
Hnin Nway San Nang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive composition
Patent number
6,579,474
Issue date
Jun 17, 2003
Fujitsu Limited
Mark Thomas McCormack
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Modules with pins and methods for making modules with pins
Patent number
6,448,106
Issue date
Sep 10, 2002
Fujitsu Limited
Wen-chou Vincent Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit structure build up method
Patent number
6,428,942
Issue date
Aug 6, 2002
Fujitsu Limited
Hunt Hang Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for making circuit substrates and electrical assemblies
Patent number
6,281,040
Issue date
Aug 28, 2001
Fujitsu Limited
Mark Thomas McCormack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced cross-talk noise high density signal interposer with power...
Patent number
6,239,485
Issue date
May 29, 2001
Fujitsu Limited
Michael G. Peters
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power conducting substrates with high-yield integrated substrate ca...
Patent number
6,226,171
Issue date
May 1, 2001
Fujitsu Limited
Solomon I. Beilin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip pre-assembly underfill process
Patent number
6,168,972
Issue date
Jan 2, 2001
Fujitsu Limited
Wen-chou Vincent Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Venting hole designs for multilayer conductor-dielectric structures
Patent number
6,106,923
Issue date
Aug 22, 2000
Fujitsu Limited
Yasuhito Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density signal interposer with power and ground wrap
Patent number
6,081,026
Issue date
Jun 27, 2000
Fujitsu Limited
Wen-chou Vincent Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer circuit substrates and electrical assemblies having con...
Patent number
6,054,761
Issue date
Apr 25, 2000
Fujitsu Limited
Mark Thomas McCormack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sputtered and anodized capacitors capable of withstanding exposure...
Patent number
5,872,696
Issue date
Feb 16, 1999
Fujitsu Limited
Michael G. Peters
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Package substrate unit and method for manufacturing package substra...
Publication number
20120067635
Publication date
Mar 22, 2012
FUJITSU LIMITED
Hnin Nway San Nang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Conductive composition
Publication number
20010030062
Publication date
Oct 18, 2001
Mark Thomas McCormack
H01 - BASIC ELECTRIC ELEMENTS