Yasuji Hara

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Ageo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flexible printed wiring board for chip-on flexibles
- Patent number 6,984,456
- Issue date Jan 10, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Kazuyuki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposition apparatus for producing electrodeposited copper f...
- Patent number 6,652,725
- Issue date Nov 25, 2003
- Mitsui Mining
- Kazuko Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of electrodeposited copper foil
- Patent number 6,444,112
- Issue date Sep 3, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Nobuyuki Imada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High tensile strength electrodeposited copper foil
- Patent number 6,194,056
- Issue date Feb 27, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High tensile strength electrodeposited copper foil and process of e...
- Patent number 5,958,209
- Issue date Sep 28, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
- Publication number 20240172359
- Publication date May 23, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230074384
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230044366
- Publication date Feb 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible printed wiring board for chip-on-film
- Publication number 20040163842
- Publication date Aug 26, 2004
- Kazuyuki Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition apparatus for producing electrodeposited copper f...
- Publication number 20010042686
- Publication date Nov 22, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Kazuko Taniguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR