Yasuji Hara

Person

Ageo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper foil
- Patent number 12,168,838
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flexible printed wiring board for chip-on flexibles
- Patent number 6,984,456
- Issue date Jan 10, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Kazuyuki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposition apparatus for producing electrodeposited copper f...
- Patent number 6,652,725
- Issue date Nov 25, 2003
- Mitsui Mining
- Kazuko Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of electrodeposited copper foil
- Patent number 6,444,112
- Issue date Sep 3, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Nobuyuki Imada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High tensile strength electrodeposited copper foil
- Patent number 6,194,056
- Issue date Feb 27, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High tensile strength electrodeposited copper foil and process of e...
- Patent number 5,958,209
- Issue date Sep 28, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
- Publication number 20240172359
- Publication date May 23, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230074384
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20230044366
- Publication date Feb 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible printed wiring board for chip-on-film
- Publication number 20040163842
- Publication date Aug 26, 2004
- Kazuyuki Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition apparatus for producing electrodeposited copper f...
- Publication number 20010042686
- Publication date Nov 22, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Kazuko Taniguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Yasuji Hara

Person

Patents Grantslast 30 patents

Electrolytic copper foil

Flexible printed wiring board for chip-on flexibles

Electrodeposition apparatus for producing electrodeposited copper f...

Manufacturing method of electrodeposited copper foil

High tensile strength electrodeposited copper foil

High tensile strength electrodeposited copper foil and process of e...

Patents Applicationslast 30 patents

ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...

ELECTROLYTIC COPPER FOIL

ELECTROLYTIC COPPER FOIL

Flexible printed wiring board for chip-on-film

Electrodeposition apparatus for producing electrodeposited copper f...