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Ageo-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Flexible printed wiring board for chip-on flexibles
Patent number
6,984,456
Issue date
Jan 10, 2006
Mitsui Mining & Smelting Co., Ltd.
Kazuyuki Okada
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrodeposition apparatus for producing electrodeposited copper f...
Patent number
6,652,725
Issue date
Nov 25, 2003
Mitsui Mining
Kazuko Taniguchi
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Manufacturing method of electrodeposited copper foil
Patent number
6,444,112
Issue date
Sep 3, 2002
Mitsui Mining & Smelting Co., Ltd.
Nobuyuki Imada
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
High tensile strength electrodeposited copper foil
Patent number
6,194,056
Issue date
Feb 27, 2001
Mitsui Mining & Smelting Co., Ltd.
Hisao Sakai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
High tensile strength electrodeposited copper foil and process of e...
Patent number
5,958,209
Issue date
Sep 28, 1999
Mitsui Mining & Smelting Co., Ltd.
Hisao Sakai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
Publication number
20240172359
Publication date
May 23, 2024
Mitsui Mining and Smelting Co., Ltd.
Ayumu TATEOKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTROLYTIC COPPER FOIL
Publication number
20230074384
Publication date
Mar 9, 2023
Mitsui Mining and Smelting Co., Ltd.
Daisuke NAKAJIMA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROLYTIC COPPER FOIL
Publication number
20230044366
Publication date
Feb 9, 2023
Mitsui Mining and Smelting Co., Ltd.
Daisuke NAKAJIMA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Flexible printed wiring board for chip-on-film
Publication number
20040163842
Publication date
Aug 26, 2004
Kazuyuki Okada
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electrodeposition apparatus for producing electrodeposited copper f...
Publication number
20010042686
Publication date
Nov 22, 2001
MITSUI MINING AND SMELTING CO., LTD
Kazuko Taniguchi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR