Yasukazu Kobayakawa

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Shiga, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package with lead wire connections and method of making...
- Patent number 5,470,796
- Issue date Nov 28, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with lead wire connections
- Patent number 5,444,299
- Issue date Aug 22, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS