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Adhesive composition and adhesive sheet
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Patent number 10,174,234
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Issue date Jan 8, 2019
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Lintec Corporation
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Tomio Hatanaka
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Flip chip mounting substrate
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Patent number 7,397,672
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Issue date Jul 8, 2008
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Lintec Corporation
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Yasukazu Nakata
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G06 - COMPUTING CALCULATING COUNTING
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IC tag
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Patent number 7,294,917
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Issue date Nov 13, 2007
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Lintec Corporation
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Taiga Matsushita
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G06 - COMPUTING CALCULATING COUNTING
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Electric wave shielding material
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Patent number 6,495,752
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Issue date Dec 17, 2002
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Lintec Corporation
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Toshio Sugizaki
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Sheet antenna
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Patent number 6,369,773
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Issue date Apr 9, 2002
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Lintec Corporation
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Kenichi Kashiwagi
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H01 - BASIC ELECTRIC ELEMENTS
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Adhesive composition and adhesive sheet
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Patent number 6,277,481
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Issue date Aug 21, 2001
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Lintec Corporation
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Takashi Sugino
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...