Yasuki Fukui

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Test socket and method of manufacturing the same
- Patent number 11,467,185
- Issue date Oct 11, 2022
- Sharp Kabushiki Kaisha
- Kazuo Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and connector
- Patent number 8,608,388
- Issue date Dec 17, 2013
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- G02 - OPTICS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 7,119,426
- Issue date Oct 10, 2006
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number RE38806
- Issue date Oct 4, 2005
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- 257 - Active solid-state devices
Information Patent Grant
Wiring substrate, semiconductor device and package stack semiconduc...
- Patent number 6,731,013
- Issue date May 4, 2004
- Sharp Kabushiki Kaisha
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having insulation layer and adhesion layer bet...
- Patent number 6,657,290
- Issue date Dec 2, 2003
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,352,879
- Issue date Mar 5, 2002
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,229,217
- Issue date May 8, 2001
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,198,165
- Issue date Mar 6, 2001
- Sharp Kabushiki Kaisha
- Yasuhisa Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,100,594
- Issue date Aug 8, 2000
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST SOCKET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210063442
- Publication date Mar 4, 2021
- Sharp Kabushiki Kaisha
- KAZUO TAMAKI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150200176
- Publication date Jul 16, 2015
- Sharp Kabushiki Kaisha
- Katsunori Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CONNECTOR
- Publication number 20100272402
- Publication date Oct 28, 2010
- Yasuki Fukui
- G02 - OPTICS
Information Patent Application
Adhesive Sheet for Dicing and Die Bonding
- Publication number 20090220783
- Publication date Sep 3, 2009
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK,...
- Publication number 20080237898
- Publication date Oct 2, 2008
- Yuji YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...
- Publication number 20080241995
- Publication date Oct 2, 2008
- SHARP KABUSHIKI KAISHA
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device
- Publication number 20070262466
- Publication date Nov 15, 2007
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of stacking semiconductor chips
- Publication number 20060197211
- Publication date Sep 7, 2006
- Sharp Kabushiki Kaisha
- Koji Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of same
- Publication number 20050253229
- Publication date Nov 17, 2005
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of stacking semiconductor chips
- Publication number 20020180025
- Publication date Dec 5, 2002
- Koji Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020096755
- Publication date Jul 25, 2002
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, semiconductor device and package stack semiconduc...
- Publication number 20020000327
- Publication date Jan 3, 2002
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS

Yasuki Fukui

Person

Patents Grantslast 30 patents

Test socket and method of manufacturing the same

Semiconductor device and connector

Semiconductor device and manufacturing method of same

Semiconductor device and method of manufacturing the same

Wiring substrate, semiconductor device and package stack semiconduc...

Semiconductor device having insulation layer and adhesion layer bet...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

TEST SOCKET AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND CONNECTOR

Adhesive Sheet for Dicing and Die Bonding

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK,...

Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...

Semiconductor device

Semiconductor device and method of stacking semiconductor chips

Semiconductor device and manufacturing method of same

Semiconductor device and method of stacking semiconductor chips

Semiconductor device

Wiring substrate, semiconductor device and package stack semiconduc...