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Yasuki Shimamura
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Conductive filler and solder material
Patent number
8,241,436
Issue date
Aug 14, 2012
Asahi Kasei EMD Corporation
Norihito Tanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Conductive Filler and Solder Material
Publication number
20090139608
Publication date
Jun 4, 2009
ASAHI KASEI EMD CORPORATION
Norihito Tanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR