Yasuko Imanishi

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead, wiring member, package part, metal part provided with resin a...
- Patent number 9,960,325
- Issue date May 1, 2018
- Panasonic Corporation
- Takahiro Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lead, wiring member, package part, metal part provided with resin a...
- Patent number 8,946,746
- Issue date Feb 3, 2015
- Panasonic Corporation
- Takahiro Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lead frame for semiconductor device and method of manufacturing of...
- Patent number 8,110,904
- Issue date Feb 7, 2012
- Panasonic Corporation
- Yasuko Imanishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN A...
- Publication number 20150104657
- Publication date Apr 16, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro FUKUNAGA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OF...
- Publication number 20110221052
- Publication date Sep 15, 2011
- Yasuko IMANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN A...
- Publication number 20110169033
- Publication date Jul 14, 2011
- Takahiro Fukunaga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...